EDI CON USA, the industry event that brings together RF/microwave and high speed digital design engineers and system integrators, is happy to announce its technical program co-chairs for the 2018 USA event.
This March 20-22, EDI CON CHINA will take place at the China National Convention Center in Beijing, China. This year’s event brings its unique, high-quality technical conference with learning and training opportunities back to Beijing.
EDI CON China 2018, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place March 20-22, 2018 at the China National Convention Center (Beijing, China), announces registration is now open and the technical program is now live at www.ediconchina.com.
After four years in Beijing, EDI CON China was held in Shanghai this year, from 27-27 April. Microwave Journal editors Pat Hindle, Gary Lerude and Janine Love compiled this overview of the conference and exhibition.