EDI CON China 2018, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place March 20-22, 2018 at the China National Convention Center (Beijing, China), announces registration is now open and the technical program is now live at www.ediconchina.com.
After four years in Beijing, EDI CON China was held in Shanghai this year, from 27-27 April. Microwave Journal editors Pat Hindle, Gary Lerude and Janine Love compiled this overview of the conference and exhibition.
Last week, DesignCon 2017 put on a show for high-speed engineers that included a conference as well as an exhibition. The conference included many opportunities for speaking, and more will be happening later this year at the EDI CON USA event in Boston, September 11-13.