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Xilinx, Inc. introduced the Zynq RFSoC DFE, a breakthrough class of adaptive radio platforms designed to meet the evolving standards of 5G NR wireless applications.

Maxim Integrated Products, Inc., demonstrates the flexibility of the MAX22515 IO-Link transceiver, seamlessly configuring all modes of the MAX22000 software-configurable analog IO. This chipset provides flexibility with faster reconfiguration to reduce factory downtime.

The IEC 61000-4-3:2020 4th edition by AR RF/Microwave Instrumentation (AR) has been released and includes the following updates: multiple test signals description, EUT and cable layout info, upper frequency limitation removal and specification of characterizing the uniform field area.

Deca announced the signing of an agreement with ADTEC Engineering to join its new AP Live Network.

Micro Crystal introduced the RV-3032-C7 real-time clock (RTC) module, which offers the world’s best time accuracy across industrial temperature range at ultra-low current consumption.

DIALOG SEMICONDUCTOR and GLOBALFOUNDRIES® announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES. The resistive ram (ReRAM)-based technology was pioneered by Adesto Technologies which was recently acquired by Dialog Semiconductor in 2020.

Smiths Interconnect provides the Mars Perseverance Rover with high performance ruggedized cPCI 2mm connectors addressing NASA’s need for a high reliability connector solution to meet the mechanical, electrical, and environmental performance requirements.

Rohde & Schwarz has added an internal analysis bandwidth of up to 1 GHz to its R&S FSVA3000 mid-range signal and spectrum analyzer.

EDI CON China 2020 returned to Beijing, China at the Chinese National Convention Center (CNCC) on 13-14 October with an in-person, live exhibition of industry-leading companies as well as a technical conference that included two days of technical presentations, workshops, awards, education forums and featured keynote talks.

EDI CON China 2020, held at the CNCC in Beijing, the finalists and winners of the EDI CON Product Innovation Awards were announced in three categories: Cables, Connectors & Materials; Semiconductors; and Test & Measurement.