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Infineon Technologies AG is launching the latest EDT2 IGBTs in a TO247PLUS package. The devices are optimized for automotive discrete traction inverters and expand Infineon's portfolio of discrete high-voltage devices for automotive applications.
Kyocera will announce its latest high-speed ceramic packages and substrates for optoelectronic devices at OFC®, the world’s largest optical fiber communication conference and exposition, March 8-10.
AmpliTech Group, Inc. announced that it and its joint venture partner SN2N LLC have delivered a fully working proof of concept of their field programmable gate array (FPGA) solution, with an intelligence-community-caliber hardware encryption communications channel.
Flex Power Modules has expanded its range of 2” x 1” encapsulated, through-hole DC/DC converters with the addition of three of the latest parts with single outputs of 24 V (21.6-26.4 V), 48 V (43.2-52.8 V) and 54 V (48.6-59.4 V).
Keysight Technologies, Inc., has, in collaboration with Telefonica, accomplished the first validation of an open radio access network (RAN) xHaul transport link, advancing development of transport networks based on the O-RAN specifications.
Dell Technologies introduces the latest telecommunications solutions and services to support the open telecom ecosystem and help communications service providers (CSPs) affordably ramp their transformation to open, cloud-native networks.
PCB East will offer a full day of free classes during its annual technical conference and exhibition in April in Marlborough, MA. The technical conference takes place April 11-13, 2022.
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