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Teledyne LeCroy, Inc., announced and demonstrated the first protocol analyzer platform for testing next-generation USB4 and Thunderbolt 3 systems.

MACOM Technology Solutions Inc., and GLOBALFOUNDRIES announced a strategic collaboration to ramp MACOM’s Laser Photonic Integrated Circuit (L-PIC) platform using GF’s current-generation silicon photonics offering, 90WG, to meet data center and 5G telecom industry demands.

II-VI Incorporated and Samtec present a new 56 Gbps PAM4 per channel demonstration of the next-generation Samtec FireFly on-board optical engine technology at OFC 2019.

MACOM Technology Solutions Inc. (“MACOM”) today announced the availability of a new family of drivers for Single-Lambda 100G and 400G applications.

MACOM Technology Solutions Inc., today announced availability of production versions of its four-channel (4 x 100G) 56/106 Gbit PAM-4 linear transimpedance amplifiers (TIAs) optimized for use in 400G optical modules targeting Cloud Data Center applications.

NEXCOM partnered up with ITRI (Industrial Technology Research Institute), FHT (First Hi-Tec), and TUC (Taiwan Union Technology Corp.) to co-develop new technology to overcome design challenges of high-speed signaling.

At the Embedded World Conference 2019, imec, a research and innovation hub in nanoelectronics and digital technologies, presented a silicon-based compact microchannel heat sink that enables high heat flux dissipation.

Rohde & Schwarz announces that starting immediately, all R&S RTO and R&S RTP oscilloscopes are delivered with the high definition mode featuring 16-bit vertical resolution. Users benefit from more measurement performance at the same price. Higher-resolution waveforms enable more precise analysis of signal details that would otherwise be hidden by noise. Users can trigger on the smallest signal details.

EDI CON China 2019, taking place April 1-3, 2019 at the China National Convention Center (Beijing, China), has announced its lineup of keynote speakers for this year’s event. 

Visitors to the EMV 2019 in Stuttgart from 19 to 21 March 2019 can look forward to a series of highlights: international exhibitors, a multi-faceted forum program, career opportunities and practice-oriented workshops.