Industry News

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EDI CON USA Announces 2017 Conference Chairs

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Mass. The event management team is pleased to announce this year’s conference chairs: Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. will serve as the chair for the high-frequency subject areas, and Istvan Novak, senior principal engineer at Oracle, will serve as the chair for the high-speed digital areas of the conference.


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Signal Integrity Journal Launches With Seven Industry Leading Sponsors

Signal Integrity Journal, a new sister publication to Microwave Journal covering signal integrity, power integrity and EMC/EMI related topics, has secured seven sponsors to start the new year. The Platinum Level sponsorships are sold out for 2017 with industry leaders Rohde & Schwarz, Anritsu, Mentor Graphics and CST filling the top sponsorship level. Joining them are Cadence and Samtec at the Gold Level and Passives Plus at the Silver Level.


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Rogers Corp. to Exhibit Advanced Circuit and Thermal Management Materials at DesignCon 2017

Rogers Corp.'s Advanced Connectivity Solutions (ACS) will feature examples of its high-performance circuit and thermal management materials for the most demanding electronic designs and working environments at DesignCon 2017, January 31-February 2, 2017 (exhibition from February 1-2, 2017) in the Santa Clara Convention Center (Santa Clara, CA). DesignCon is a premiere event for electronic design engineers working on circuit and system levels.


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Robust Industrial Grade X2 Capacitors With a Rated Voltage of  350 V AC

TDK Corp. presents a new series of robust EPCOS MKP X2 capacitors for EMI suppression. Compared with conventional X2 capacitors designed for rated voltages of 305 V AC, these new components offer a higher rated voltage of 350 V AC. This makes them suitable for EMI suppression in input filters – specifically for applications on the North American market – and output filters of photovoltaic inverters.


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Fast 16-Bit 1.5Msps/Channel Octal Simultaneous Sampling SAR ADC Maintains AC Performance

Linear Technology Corp. introduces the LTC2320-16, a 16-bit 1.5Msps per channel, no latency successive approximation register (SAR) ADC with eight simultaneously sampling channels supporting a rail-to-rail input common mode range. The LTC2320-16 features a flexible analog front end that accepts fully differential, unipolar or bipolar analog input signals, as well as arbitrary input signals, and maintains an 82dB signal-to-noise ratio (SNR) and high common mode rejection ratio (CMRR) of 102dB, when sampling input signals up to the Nyquist frequency.


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Keysight Technologies Announces Free Signal and Power Integrity Workshop

Keysight Technologies is offering a free workshop specifically designed for signal and power integrity engineers trying to accurately model their printed circuit boards (PCBs)—a task that is now more challenging given today’s ever increasing data rates. During the hands-on workshop, titled “Keysight EEsof EDA Simulation Tools for Signal Integrity and Power Integrity,” attendees will learn about new tools in ADS 2016 that can improve PCB simulation accuracy; in particular, the pure electromagnetic-simulation-based SIPro (Signal Integrity Professional) and PIPro (Power Integrity Professional). SIPro and PIPro provide a cohesive workflow within ADS for signal integrity and power integrity applications in high-speed digital board design.


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Molex and TE Connectivity Collaborate on Next-Gen Data Communications Electronic Products

Molex LLC and TE Connectivity (TE) will collaborate on the launch and promotion of select new connector and cable assembly products that enable the growing number of high-speed applications required as data centers evolve with hyperscale models and increased virtualization. The DSA will support today’s data speeds and up to 56 Gbps and beyond. The scope of the agreement includes next-generation connector products, and the DSA is intended to build on the successful history with standard second source agreements for products such as: zSFP+ interconnects, zQSFP+ interconnects, CDFP interconnects, microQSFP interconnects, and Nano-Pitch I/O interconnects.


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