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Rohde & Schwarz has announced details for the one-day U.K. seminar of its Demystifying EMC European tour, to be held at the Leonardo Hotel and Conference Venue, Hinckley Island, Leicestershire, on 21 March 2024.
Infineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality, and total cost of ownership for AI data centers.
ZTE Corporation has announced a successful verification of the longest terrestrial long-haul transmission over 2000 km based on commercial 800G pluggable coherent modules and single carrier architecture without regeneration in collaboration with Turkcell.
Keysight Technologies, Inc. announced that the RFPro EM simulation software is now certified by Intel Foundry for design engineers targeting Intel 18A process technology.
Imec’s massively time-interleaved slope-ADC prototype chip demonstrates superior scalability to meet data centers’ exploding bandwidth and data processing demands.
Renesas Electronics Corporation announced that it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access memory test chip with fast read and write operations.
Siemens Digital Industries Software announced that its Calibre nmPlatform tool for IC design verification and its Analog FastSPICE Platform are now both certified for Intel 18A and Intel 16 process technologies.
Nokia, in collaboration with Intel, have announced that they are targeting greater energy efficiency improvements in 5G networks by using Xeon processors and power management software from Intel that will power Nokia’s cloud-native 5G Core solutions.