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For power conversion in industrial and telecom applications, the Vishay Siliconix SiZF4800LDT increases power density and efficiency while enhancing thermal performance, reducing component counts, and simplifying designs.
Saelig Company, Inc. has announced three new series of 12-bit Siglent HD oscilloscopes designed to improve signal fidelity, visualization, and analysis, adding to the previously announced SDS2000X-HD 12-bit oscilloscopes.
Infineon Technologies AG introduces the 750V G1 discrete CoolSiC MOSFET to meet the increasing demand for higher efficiency and power density in industrial and automotive power applications.
Rohde & Schwarz has announced details for the one-day U.K. seminar of its Demystifying EMC European tour, to be held at the Leonardo Hotel and Conference Venue, Hinckley Island, Leicestershire, on 21 March 2024.
Infineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality, and total cost of ownership for AI data centers.
ZTE Corporation has announced a successful verification of the longest terrestrial long-haul transmission over 2000 km based on commercial 800G pluggable coherent modules and single carrier architecture without regeneration in collaboration with Turkcell.
Keysight Technologies, Inc. announced that the RFPro EM simulation software is now certified by Intel Foundry for design engineers targeting Intel 18A process technology.