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At the international VDI Congress ELIV (Electronics In Vehicles) in Bonn, Germany (October 18-19, 2017), Maxim Integrated Products, Inc. (NASDAQ: MXIM) will demonstrate how it empowers automotive design innovation through unique mixed signal and analog solutions for the car of the future. Designing tomorrow’s vehicles calls for technology that keeps up with increasing demands for greater safety and connectivity.

The International MegaGauss Science Laboratory, part of the Institute Solid State Physics (ISSP) at the University of Tokyo, is attempting to set a new world record for the highest ever, indoor magnetic field. To do this, the ISSP needed to improve the precision of the firing processes with sub-nanosecond measurements and has installed a Spectrum Instrumentation digitiser to achieve this.

Passive Plus, Inc. (PPI) offers a line of Hi-Q Capacitors available in 5 larger case sizes. Specifically produced for high power / high frequency requirements, these products are available in surface mount or leaded configurations that are 100% RoHS compliant and are also available in a Non-Magnetic termination.

Samtec announces the release of a new low-profile PCI Express^® edge card connector featuring Edge Rate® contacts for optimized signal integrity. The connector is PCI Express^® Gen 4 compliant and supports one, four, eight and sixteen links for different bandwith requirements.

Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTM8065, a µModule^® (power module) step-down regulator with up to 40V input voltage (42V abs max), which can safely operate from unregulated or fluctuating 12V to 36V input supplies in noisy environments such as industrial robotics, test and measurement, medical, factory automation and avionics systems.

The AXIe Consortium announced a new specification, Optical Data Interface, suitable for high-speed instrumentation systems addressing challenging applications in 5G communications, mil/aero, and advanced communication research. The AXIe Consortium was joined by Conduant Corporation, Guzik Technical Enterprises, Intel Corporation, Keysight Technologies, Samtec Incorporated, and Xilinx in endorsing the standard and stating their plans to offer components or instrumentation products compliant with the new standard.

Samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System with new DMO options. System designers can now leverage the inherent advantages of direct mate orthogonal architectures when compared with traditional backplane systems.

The German Fraunhofer Heinrich Hertz Institute HHI and Silicon Valley Missing Link Electronics (MLE) collaborate to optimize 25G/50G Ethernet Low-Latency Media Access Controller (MAC) for Xilinx Ultrascale+ Transceiver Technology.

EDI CON China 2018, the conference that brings together engineers working on high-frequency analog and high-speed digital designs and takes place March 20-22, 2018 at the China National Convention Center in Beijing, announces the Call for Abstracts for its technical sessions is open.

Keysight will host a complementary seminar on crosstalk and jitter challenges, from simulation to test. Keysight technical experts MinJie Chong and Hee-Soo Lee will discuss and demonstrate the latest tools and techniques for solving these challenges. Lunch is provided.