May 23, 2017

Sponsored by: Rohde & Schwarz

Sierra Circuits

Featured Article

Better, Faster, More Confident 25+ Gbps Via Design: Applying Decomposition and Image Impedance

By Ben Toby, Karl Bois

Vias can become particularly painful to optimize as bandwidth increases: largely due to the increased influence of their barrels. Designers can easily get trapped in a cycle of iterating over and over as they try to find a structure that works for every layer.



Mentor Graphics

HyperLynx Technology Update
By Mentor Graphics

This white paper addresses the integration of signal and power integrity analysis, 3D-electromagnetic solving, and fast DRC checking in a single unified environment.



Infineon Starts Volume Production of First Full-SiC-Module
By Infineon

The new 1200 V SiC MOSFETs have been optimized to combine high reliability with performance. They show dynamic losses which are an order of magnitude lower than 1200 V silicon (Si) IGBTs.


Spectrum GmbH

Spectrum's New Boxcar Function Smooths Out Noise to Give Clear Signals
By Spectrum GmbH

Spectrum GmbH has released a new function for its extensive range of modularly designed digitizers. The Boxcar averaging function smooths out high frequency noise to give a clear signal.



Sierra Circuits

Understanding Signal Integrity for PCB Layout
By Sierra Circuits

This article reviews sources of signal degradation and steps to mitigate them.




High-Speed Circuit Board Signal Integrity, Second Edition Released

This thoroughly updated leading-edge circuit design resource presents the underpinnings and practical guidance needed to analyze, investigate, and solve signal and power integrity issues.






Signal Integrity Webinar

Learn from our library of archived webinars for on-demand viewing

Here are last week’s if you missed them:

New Connectors for High-Speed Applications

Date: May 15, 2017
Time: 8am PT/ 11am ET
Sponsored by: CST - Computer Simulation Technology
Presented by: Joseph C. (Jay) Diepenbrock, Independent Consultant

Laminate Materials Characterization for High Speed Applications

Date: May 17, 2017
Time: 8am PT/ 11am ET
Sponsored by: Sierra Circuits
Presented by: Yuriy Shlepnev, President and Founder of Simberian Inc.


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