May 23, 2017
Better, Faster, More Confident 25+ Gbps Via Design: Applying Decomposition and Image Impedance
Vias can become particularly painful to optimize as bandwidth increases: largely due to the increased influence of their barrels. Designers can easily get trapped in a cycle of iterating over and over as they try to find a structure that works for every layer.
Infineon Starts Volume Production of First Full-SiC-Module
The new 1200 V SiC MOSFETs have been optimized to combine high reliability with performance. They show dynamic losses which are an order of magnitude lower than 1200 V silicon (Si) IGBTs.
Spectrum's New Boxcar Function Smooths Out Noise to Give Clear Signals
Spectrum GmbH has released a new function for its extensive range of modularly designed digitizers. The Boxcar averaging function smooths out high frequency noise to give a clear signal.
High-Speed Circuit Board Signal Integrity, Second Edition Released
This thoroughly updated leading-edge circuit design resource presents the underpinnings and practical guidance needed to analyze, investigate, and solve signal and power integrity issues.
Learn from our library of archived webinars for on-demand viewing
Here are last week’s if you missed them:
New Connectors for High-Speed Applications
Date: May 15, 2017
Laminate Materials Characterization for High Speed Applications
Date: May 17, 2017
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