May 16, 2017

Sponsored by: Anritsu

Sierra Circuits

Featured Article

How Bad are Swiss Cheese Planes?

By Eric Bogatin

Holey Swiss cheese offers a popular metaphor for describing planes with a high density of clearance holes, usually under a BGA escape. Since the gaps between them is narrow, won’t they constrict the current, dramatically increasing the series resistance and the loop inductance of the planes?

EDICON China 2017

EDI CON China 2017 Celebrates First Year in Shanghai

By Janine Love and Pat Hindle

In addition to a robust three-day exhibition at the Shanghai Convention & Exhibition Center of International Sourcing, EDI CON China provided three days of peer-reviewed and carefully curated conference sessions for attendees, featuring 71 technical sessions, 43 workshops, three panels and a plenary keynote session.




How to Accurately Model a Multi-Gigabit Serial Link 10 Times Faster
By Cadence Design Systems Inc.




Designing Power for Sensitive Circuits
By Steve Sandler

This article highlights some of the most common mistakes engineers make and share some fundamental rules for designing clean power for sensitive circuits. Applying these rules will result in higher performance, lower cost designs with fewer design iterations.


Signal Microwave

40 and 70 GHz Test Boards Verify VNA Cals
By Signal Microwave, Chandler, Ariz.; GigaProbes, San Carlos, Calif.

Signal Microwave and GigaProbes have developed a line of 40 and 70 GHz test boards for verifying VNA calibration (cal) and checking for measurement drift.



Rohde and Schwarz

Accurate and fast power integrity measurements
By Rohde & Schwarz

Measuring ripple, noise and transients on today’s low-voltage DC power rails challenges most oscilloscopes. With smaller rail voltages and 1 % to 2 % tolerances, instrument and probing noise make it hard to accurately measure specified tolerances. Adequate bandwidth is required to see harmonics of fast edges and higher frequency sources that can be coupled on power rails.


Signal Integrity Webinar

Laminate Materials Characterization for High Speed Applications

Date: May 17, 2017
Time: 8am PT/ 11am ET
Sponsored by: Sierra Circuits
Presented by: Yuriy Shlepnev, President and Founder of Simberian Inc.


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