April 21, 2020

Sponsored by: Rohde & Schwarz

Rohde & Schwarz


How Interconnects Work: Traces Between Parallel Planes

By Yuriy Shlepnev

Transverse electromagnetic waves are used to transmit the signal between components while PPW waves are used to deliver power to the components. Both waves are useful, but they have to be separated. Yuriy Shlepnev, member of the SIJ Editorial Advisory Board, explains why.


Seven Habits of Successful 2-Layer Board Designers

By Eric Bogatin

If performance matters, if the interconnects are not transparent, or if you want to develop good habits, you will want to incorporate these seven habits in your next two layer board design.


News Feature2

High-Performance Power Inductors Reduce DC Resistance by Up to 40 Percent

Coilcraft’s XGL4030 series of high-performance, molded power inductors offer up to 40 percent lower DCR than the previous inductors as well as extremely low AC losses, resulting in the best overall efficiency over a wide range of AC ripple current.

News Feature1

ZTE Wins the World’s Largest Commercial OTN in China Mobile’s Phase-13 Centralized Procurement

ZTE Corporation announced that it secured the western network project in China Mobile’s phase-13 centralized procurement for inter-provincial backbone transport network equipment. The western network, covering 19 provinces of China, will be the world’s largest commercial optical transport network, with a total link length reaching 53,828km.





Become a Signal Integrity Detective

Sponsored By Keysight Technologies Inc.

As digital speeds increase, signal integrity becomes harder to confirm. Hidden problems such as crosstalk and jitter can result in late-stage design failures if they go undetected. The best way to identify these problems is to simulate early on in the design cycle. Detect hidden issues to save time and maximize your design margin. Learn the three steps to overcome signal integrity challenges in high-speed designs. Download the white paper.

EDI CON Online

Watch On-Demand: Test Fixture De-embedding for PCB Characterization and Material Extraction

This SI/PI Technical Session presented by James Drewniak covered de-embedding using a 2X thru approach, and suitable test fixture development for successful de-embedding to high frequencies will be discussed. The specific application presented will be PCB material characterization.

Register now for this on-demand session, it's FREE.

Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience.
Browse webinars here.




PCB West brings together engineers, designers, fabricators, assemblers and managers to improve skills, increase knowledge and network. PCB West returns to the Silicon Valley Sept. 8 -11, 2020, with a one-day exhibition and four-day technical conference and certificate program for SI/PI and PCB engineers of all levels of experience and knowledge. Come see why attendees call it “second to none” and “the show of the year you will want to attend. Discover more.


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