Title: Test Fixture De-embedding for PCB Characterization and Material Extraction

Date: September 12, 2019

Time: 11:00am PT / 2:00pm ET

Presented by: James Drewniak, Curator’s Professor of Electrical and Computer Engineering at Missouri S&T

Abstract:

Many aspects of printed circuit board layout and design for signal integrity require measurement verification, for example, connector interfaces, via transitions, and material characterization. However, the location, or port, at which S-parameters are desired are typically at some interior point on the PCB design, and removed from the measurement port where cables or probes are located. Consequently, this test fixturing must be de-embedded before using the measured S-parameters for comparison with simulation, in channel analysis, or for material extraction. De-embedding using a 2X Thru approach will presented, and suitable test fixture development for successful de-embedding to high frequencies will be discussed. The specific application presented will be PCB material characterization.

Presenter Bio:
James L. Drewniak is a Curator’s Professor of Electrical and Computer Engineering at Missouri S&T. He received B.S., M.S., and Ph.D. degrees in electrical engineering from the University of Illinois at Urbana-Champaign. His research is in electromagnetic compatibility, signal and power integrity, and electronic packaging. He is with the Missouri Electromagnetic Compatibility Laboratory, a university research laboratory of approximately 70 people that is internationally recognized for research in EMC and signal and power integrity. A key component of the research sponsorship is the National Science Foundation Industry/University Cooperative Research Center (I/UCRC) for Electromagnetic Compatibility that is a consortium of over 20 companies. He is a Fellow of the IEEE, 2013 recipient of the IEEE EMC Society’s Richard R. Stoddart Award, and a past Associate Editor of the IEEE Transactions on EMC. 

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