September 25, 2018

Sponsored by: Teledyne LeCroy



State of the Art Laminates Still Have Some Life Left

By Eric Bogatin

Advancing interconnect options to the next higher data rate generation seems to get harder and harder. Eric Bogatin reviews a presentation by Terence Regan, a Field Application Engineer from Amphenol, and shares his thoughts on the topic of high-performance interconnect design and fabrication. In this piece, Eric addresses where we are, what has been accomplished, and reflects on the trade-offs moving forward.


ANSYS 19.2 Delivers Faster Problem-Solving Capabilities Across the Entire Portfolio

The newly released ANSYS® 19.2 enables customers to solve their most difficult product development challenges faster than ever. With product lifecycles continuing to shrink and trends in additive manufacturing, autonomous vehicles, electrification and 5G connectivity rapidly evolving, the pressure for companies to deliver innovative products is at an all-time high.

TE Connectivity  

TE Connectivity Introduces 124 Position Sliver Connectors and Cable Assemblies

TE Connectivity (TE), introduced its new 124 position Sliver internal I/O connectors and cable assemblies, which provide a high density solution that enables up to x20 signal transmission lanes, or 40 differential pairs. The 124 position Sliver connectors currently support PCIe Gen 4 and Gen 5, Ethernet 56G and SAS-5.




Broadband Application Note

By Passive Plus Inc.

This note focuses on a particular implementation of Broadband and Multilayer Ceramic Capacitors and how to obtain the best performance when they’re used on various substrates. Download the app note to learn more.

EDI CON 2018

Technical Program Highlights

Thinking about attending EDI CON this year? The event takes place October 17-18 at the Santa Clara Convention Center. A Conference pass gets you access to the 5G Symposium, EDI CON University, Welcome Reception, High Speed Digital Symposium, Technical Papers on microwave, RF, mmwave, and high-speed digital topics, workshops, and plenary keynote talks. Begin penciling in your EDI CON schedule, register today and get 30% off conference pass admission with code: #EDICON18.


R&S Demo at IEEE EMC SIPI 2018

EMI Receiver Compliance Measurement Demonstration

Rohde & Schwarz ESW receiver to 44 GHz demonstrates rapid EMI Compliance measurement and real-time spectrum analysis for diagnosing problems at IEEE EMC SIPI 2018. See additional videos here.

Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience.
Browse webinars here.


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