September 11, 2018

Sponsored by: EDI CON USA



Shielding and Filtering Are Not Independent of One Another

By Keith Armstrong

I have lost count of the number of times I have been asked to fix an EMC problem, only to find that a shielding box has been designed or purchased to provide XdB up to fMAX. Or a filter has been designed or purchased with a similar specification, but to reduce cost the filter has been mounted on a printed circuit board (PCB) inside the box, with a cable from it entering or exiting the box through a plain connector. Discover more.

Flex Power

Flex Power Modules Debuts 700w Half-brick DC/DC Converters to Power RFPA Applications in LDMOS or GaN Technology

Flex Power Modules announced the release of the PKJ4000 series of DC/DC converters primarily targeting radio frequency power amplifier (RFPA) applications within the telecom market segment. The PKJ4000 series delivers 28V DC or 50V DC at up to 700W of power from an input voltage range of 36V to 75V.


New Infineon System Basis Chips Are the First to Allow High Speed Communication with up to 5 Mbit/s

Infineon Technologies is launching two new System Basis Chip (SBC) families: Lite and Mid-Range+. They are the first SBCs on the market supporting the ISO CAN FD protocol for communication at 5 Mbit/s for a large variety of automotive applications.


Rohde & Schwarz


Precise Measurements on High-speed Digital Signal Lines with the R&S®ZNB

By Rohde & Schwarz
When performing tasks such as verifying digital high-speed signal structures on PCBs, measurements have to be carried out on certain layers without the effects of probes, probe pads, VIAs, lead-ins and lead-outs. This requires the use of accurate de-embedding algorithms to calculate and remove these effects from the measurements, leaving only the result for the area of interest. Download the app note.

Register Now for EDI CON USA

Register Now for EDI CON USA

Thinking about attending EDI CON this year? The event takes place October 17-18 at the Santa Clara Convention Center. The conference will feature Eric Bogatin’s High Speed Digital Symposium, EDI CON University tutorials, panels, technical sessions, and workshops with hands-on techniques covering SI, PI, EMC/EMI, as well as RF and microwave topics. The exhibition floor will be open both days, complete with exhibitors and demonstrations and panels in the Frequency Matters Theater on the show floor. Join us for learning, networking, keynotes, and the opportunity to see the latest products in SI, PI, EMC/EMI, RF, and microwave. Get 30% off conference pass admission with the code: #EDICON18.


Eric Bogatin Session

Eric Bogatin Oscilloscope Basics Session

Eric Bogatin, Technical Editor at Signal Integrity Journal and the Dean of the Teledyne LeCroy Signal Integrity Academy, gives an overview of what to look for when setting up an oscilloscope for measurement at IEEE EMC SIPI 2018. See additional videos from IEEE EMC SIPI here.

Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience.
Browse webinars here.

The preceding is from Signal Integrity Journal™, owned by Horizon House Publications Inc., at 685 Canton St., Norwood, MA, 02062, USA. We are online at and are also available at 781-769-9750. Copyright © 2018. All Rights Reserved. Your email address has not been given to any Third Parties. You have been selected to receive this email because you opted-in to receive information when you provided your email address to Signal Integrity Journal™. To ensure deliverability of emails from Signal Integrity Journal™, we recommend that you whitelist our domain address:

Unsubscribe/Update Profile | Browser View | Forward to a Friend | Privacy | Subscribe to Signal Integrity Journal