Items Tagged with 'PCB Fabrication'

Within the PCB industry, FR-4 materials have long been accepted as “standard” materials. However, their use was not specific to the types of board being designed. For today’s high-speed, high-frequency designs, careful engineering and material selection relative to the resin systems and glass weave styles needed will ensure that a product will work as specified, as designed, and as manufactured. In addition, the finish of the copper used in the signal and power layers also needs to be controlled in order to ensure that loss goals are met.

In this article, Kella Knack outlines the stackup process, highlighting the importance of taking material issues, structural issues, and performance factors into account from the beginning of the design process. Knack discusses how providing fabricators with proper design documentation that includes precise information enables them to build to specification, ensuring correct functionality while avoiding additional costs for design.

The conventional PCB fabrication process for printed circuit boards is subtractive. Averatek recently introduced a new chemistry technology making semi additive circuit board fabrication more attractive for ultra fine line applications. SIJ’s technical editor, Eric Bogatin, takes a closer look.