Items Tagged with 'Vias'

ARTICLES

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How to Stop Your Differential Vias from Leaking

Can common via structures transfer any data rate or are they limited with a defined bandwidth? If so, what limits its bandwidth? And what can be done when the bandwidth of the signal is greater than the bandwidth of the G-S-S-G structure? This technical feature from Dror Haviv explains.


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40 GHz PCB Interconnect Validation: Expectations vs Reality

What does it take to design PCB interconnects with good analysis-to-measurement correlation up to 40 GHz? Is it doable with typical low-cost PCB materials and fabrication process, typical trace width, via back-drilling and the shortage of space to place the stitching vias? This paper reports lessons learned from validation projects with the goal to build a formal procedure for systematic prediction of interconnect behavior up to 40 GHz. Topics include: selection of test structures, connectors and measurement equipment, and analysis uncertainties.

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Via Characterization and Modeling By Z Input Impedance

In high-speed digital channel design, vias are everywhere and are becoming very crucial elements to the channel performance. Especially with the higher data rate requirements in mobile, networking, and data center applications, the effect of vias in a design is very noticeable. Design engineers have traditionally used time domain reflectometry (TDR) as a tool to characterize and optimize via designs, yet the TDR approach comes with shortcomings such as demanding shorter rise-time step signal or larger bandwidth S-parameters, and inaccurate read-out on the via impedance.

In this article, we propose a simple and effective Z-input impedance method that augments the traditional TDR method for characterizing and optimizing via designs in much faster speed systems.


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