Articles by Patrick Hindle

DC

DesignCon 2018 Preview

DesignCon 2018 will feature a 14-track conference covering the latest developments in hardware and high-speed communications design. The conference will also have over 100 technical sessions, three full day boot-camps, and more. Signal Integrity Journal has collected the following exhibition highlights as a preview to what you will see in the exhibition hall.


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Top 10 Articles for 2017

As rated by reader views, here are the Top 10 Articles on Signal Integrity Journal for 2017. Thank you for your readership in 2017, and we look forward to bringing you many more great technical features in 2018!


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EMC2017

EMC in the Capital

IEEE EMC SI/PI 2017 Summary

The 60th IEEE EMC SI/PI Symposium took place August 7-11 at National Harbor in Washington DC with the “plan to inspire, envision, and innovate.” The keynote set the stage for this plan as Julius Knapp, FCC Chief of the Office of Engineering and Technology, discussed the status of the FCC and industry EMC standards, the equipment authorization program and enforcement as the wireless space becomes more and more crowded with emerging technologies such as IoT, connected/autonomous vehicles, UAVs, increased satellite broadband and 5G taking off.


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NIWeek2017

Engineer What’s Next – NIWeek 2017

This is the first year that NIWeek has taken place in late May instead of its normal early August time slot and switches permanently to this part of the calendar. NIWeek 2017 kicked off with new CEO Alex Davern paying tribute to Dr. T with a standing ovation from the audience. Read this summary of what happened at NIWeek 2017.


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DesignCon2017

Hanging out with Chiphead - DesignCon 2017 Overview

We paid our annual homage to the coolest event mascot, Chiphead, at DesignCon 2017. DesignCon is the annual meeting place for chip, board, and systems design engineers taking place at the end of January each year in Santa Clara, CA. There were more than 100 sessions spanning 14 tracks covering all aspects of electronic design; from chips through boards and systems.


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