Janine Love

As rated by reader views, here are the Top 10 Articles on Signal Integrity Journal for 2018. Thank you for your readership in 2018, and we look forward to bringing you many more great technical features in 2019!

SIJ talked with Roger Tushingham about how to foster innovation and next-generation circuit materials needs.

SIJ talked with Martin Stumpf about industry trends, how to foster innovation, and what today’s designers need most from their test equipment.

This spring, Molex and Samtec announced a collaboration on next-generation data center solutions. SIJ caught up with Brian Vicich of Samtec, Inc and Brent Hatfield of Molex to find out what that means for engineers.

SIJ talked with Dave Kohlmeier about industry trends, how to foster innovation, and what today’s EDA customers need most.

Eric Bogatin will lead this special session again at EDI CON USA, taking on the topic of how to deliver more than 100A with less than 10 mV of noise to digital devices. See how you can get involved.

EDI CON China 2018, taking place March 20-22, 2018 at the China National Convention Center in Beijing, announces the finalists in the first EDI CON Innovation Awards.

EDI CON USA, the industry event that brings together RF/microwave and high speed digital design engineers and system integrators, is happy to announce its technical program co-chairs for the 2018 USA event.

This March 20-22, EDI CON CHINA will take place at the China National Convention Center in Beijing, China. This year’s event brings its unique, high-quality technical conference with learning and training opportunities back to Beijing.