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EDI CON China 2018, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place March 20-22, 2018 at the China National Convention Center (Beijing, China), announces registration is now open and the technical program is now live at www.ediconchina.com.
The Call for Abstracts for EDI CON USA 2018 has opened; selected papers will be presented at EDI CON USA 2018, held October 17-18, 2018 at the Santa Clara Convention Center, Santa Clara, Calif.
After four years in Beijing, EDI CON China was held in Shanghai this year, from 27-27 April. Microwave Journal editors Pat Hindle, Gary Lerude and Janine Love compiled this overview of the conference and exhibition.
If you’re looking for a handbook on SI characterization techniques, or more specifically, TDR and VNA measurements, check out the second edition of this popular book.
Last week, DesignCon 2017 put on a show for high-speed engineers that included a conference as well as an exhibition. The conference included many opportunities for speaking, and more will be happening later this year at the EDI CON USA event in Boston, September 11-13.