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Enterprise applications which require precise time synchronization now have access to the latest technology as HUBER+SUHNER launches a new version of the world’s first copper-free fiber-powered link.

Infineon Technologies AG introduces the SSO10T TSC package with OptiMOS MOSFET technology.

Tektronix, Inc shared the availability of a new remote procedure call (RPC)-based solution, TekHSI, for faster data transfer from testing instruments to a user’s PC.

Fast Photonics USA has announced the opening of its new manufacturing facility in Richardson, Texas.

Ansys announced a collaboration with NVIDIA to develop next-generation simulation solutions powered by accelerated computing and generative AI.

Semiconductor device revenue for mobile & consumer reached $296 billion in 2023, following a -15% year-on-year-setback.

Corning Incorporated has announced the launch of its Multifiber Pushlok Technology, the latest advancement in its award-winning Evolv portfolio of connectivity solutions.

Samtec, Inc. will be demonstrating next-gen, high-performance optical and copper interconnect solutions at the upcoming OFC 2024 Exhibition, the premier global event for optical communications and networking.

Spectrum Instrumentation has released a new firmware option for its range of versatile 16-bit AWGs with sampling rates up to 1.25 GSPS and bandwidths up to 400 MHz. 

Keysight Technologies, Inc. and Credo Semiconductor set a new milestone by developing a joint testbed that demonstrates the first IEEE P802.3dj draft specification compliant 1.6 terabit Ethernet measurement system running full line rate layer 2 Ethernet traffic on a real world hardware development platform.