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Tektronix, Inc shared the availability of a new remote procedure call (RPC)-based solution, TekHSI, for faster data transfer from testing instruments to a user’s PC.

Fast Photonics USA has announced the opening of its new manufacturing facility in Richardson, Texas.

Ansys announced a collaboration with NVIDIA to develop next-generation simulation solutions powered by accelerated computing and generative AI.

Semiconductor device revenue for mobile & consumer reached $296 billion in 2023, following a -15% year-on-year-setback.

Corning Incorporated has announced the launch of its Multifiber Pushlok Technology, the latest advancement in its award-winning Evolv portfolio of connectivity solutions.

Samtec, Inc. will be demonstrating next-gen, high-performance optical and copper interconnect solutions at the upcoming OFC 2024 Exhibition, the premier global event for optical communications and networking.

Spectrum Instrumentation has released a new firmware option for its range of versatile 16-bit AWGs with sampling rates up to 1.25 GSPS and bandwidths up to 400 MHz. 

Keysight Technologies, Inc. and Credo Semiconductor set a new milestone by developing a joint testbed that demonstrates the first IEEE P802.3dj draft specification compliant 1.6 terabit Ethernet measurement system running full line rate layer 2 Ethernet traffic on a real world hardware development platform.

ZTE Corporation announces its collaboration with China Mobile in activating the world's first ultra-long-haul optical backbone link based on 400G Quadrature Phase Shift Keying (QPSK) technology.

Richardson Electronics, Ltd.  announced a global distribution agreement with Ideal Power for products including the discrete B-TRAN device and SymCool power module.