Industry News

RSS

SnapEDA, is releasing the SnapEDA for Autodesk® Fusion 360® app in collaboration with Autodesk. This app integrates SnapEDA’s database directly within Fusion 360, enabling electronics engineers and designers to search and place millions of electronic component models - including symbols, footprints and 3D models - directly within the Fusion 360 environment.

This year's Keysight Innovation Challenge focuses on undergraduate engineering and pre-engineering students enrolled in a historically black college or university (HBCU) to innovate new business opportunities and create videos that demonstrate electronics measurement techniques.

Avishtech announced the availability of the latest version of its Gauss Stack PCB stackup design and simulation solution. This version includes an extensive dielectric materials library that enables rapid specification and implementation of a complete stackup design.

Pico Technology has added the PicoScope 9402-05 and 9402-16 two-channel models to their already popular 5 GHz and 16 GHz SXRTOs. Ideally suited to repetitive or clock-derived signals, all models feature high-resolution 12-bit channels.

Averatek Corporation has launched the A-SAP™ Community of Interest, a web-based content platform developed as a central resource for the industry: so that all members of the supply chain can exchange information and insights about the A-SAP, PCB fabrication process. 

Keysight Technologies, Inc., has launched the SL1200A Series Scienlab Regenerative 3-Phase AC Emulator. It is a comprehensive one vendor solution consisting of hardware, software, consulting and support services for electric vehicle (EV) and electric vehicle supply equipment (EVSE) charging applications and grid-edge applications.

Orbel announces the latest development in shielding technology, the Groove-Loc^TM EMI Shield!

Purdue University engineers have addressed an issue barring the development of quantum networks that are big enough to reliably support more than a handful of users. The method could help lay the groundwork for when a large number of quantum computers, quantum sensors and other quantum technology are ready to go online and communicate with each other.

Artech House announced the publication PCB Design Guide to Via and Trace Currents and Temperatures by Douglas Brooks and Johannes Adam. A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current.

Teledyne SP Devices announced the release of ADQ32 and ADQ33—a fourth-generation modular data acquisition boards optimized for high-throughput applications.