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Selecting printed-circuit-board (PCB) materials that support modeling with modern computer-aided-engineering (CAE) simulation software and help achieve excellent signal integrity (SI) for high-speed digital circuits usually starts with key material parameters, such as dielectric constant or Dk.

A Unique Hands-on Opportunity to Characterize Interconnects to 50 GHz, sponsored by the IEEE P370 Standards group and Samtec.

We’ve come to the end of our first complete year of online publication. Our Editorial Advisory Board (EAB) has done a superb job of nudging us in the right direction, contributing high value technical pieces and reviewing all the technical content submitted to the Signal Integrity Journal. As a final passing favor to the SI, PI and EMC community of readers, we want to leave all of our readers with a year-end holiday gift.

As rated by reader views, here are the Top 10 Articles on Signal Integrity Journal for 2017. Thank you for your readership in 2017, and we look forward to bringing you many more great technical features in 2018!

Wondering what IBIS Open Forum actually does? Mike LaBonte lifts the curtain and invites you to learn more about IBIS models.

Not an official award, per se, but Eric Bogatin gives his top pick for his favorite demo at the recent EMC event in Washington DC.

Traditional swept-tuned EMI spectrum analyzers and step-tuned EMI receivers may produce misleading or entirely false measurement results when the signal under study is not steady state, but transient. See Eric Bogatin's review of a demo by Lee Hill on this subject.

Printed circuits for high-speed and high-frequency applications rely on fine-featured transmission lines for signal transmission. Ideally, the loss through these transmission lines is minimal, and this requires an electrical impedance that is consistent and without interruptions, and with a value most appropriate for the types of signals to be transferred through the circuit. However, a number of factors can affect the impedance of a PCB, including the physical and electrical characteristics of the circuit and circuit material, but by reviewing and better understanding these variables, their effects can be minimized.