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Qubic announced it has secured a $925,000 (CAD) grant from the Government of Canada through its department of Innovation, Science and Economic Development and the FABrIC program, administered by the Canadian Microelectronics Corporation.
Yole Group unveils its latest photonic market and technology analyses, "Silicon Photonics 2025" and "Co-Packaged Optics for Data Centers 2025," which explore how AI-driven demand is reshaping connectivity, from transceivers to packaging innovation.
Socionext announced the
availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for
consumer, AI, and HPC data center applications that include chiplets, 2.5D, 3D, and 5.5D packaging.
The new component packages of the WE-CMDC series enable effective noise suppression at a rated current up to 10 A, making these compact filter components ideal for modern high-current applications.
Infineon has announced the strengthening of its existing collaboration with Delta Electronics, Inc., in the development of state-of-the-art high-density power modules capable of enabling vertical power delivery to AI processors in hyperscale data centers.
Yole Group releases its annual report, "Status of the Advanced Packaging Industry 2025," featuring exclusive market ranking and in-depth analysis of leading players.
TDK Corporation has expanded its PLEC69B series of thin-film inductors, used for separating the data signal from the power in optical transceivers in AI data centers.
Infineon Technologies AG is expanding its CoolSiC™ MOSFETs 650 V G2 portfolio with new 75 mΩ variants to meet the demand for more compact and powerful systems.
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