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Preliminary findings from Dell'Oro Group's recently updated "Private Wireless" report suggest that the positive momentum driving the roughly 40% increase in 2024 extended into 1H25, with worldwide private wireless RAN revenues accelerating rapidly in the first half.

YINCAE is proud to announce the release of UF 66L, a next-generation OCU engineered for silicon photonics, optoelectronic packaging, image sensors, AR/VR modules, and advanced flip-chip assemblies where optical clarity, thermal endurance, and reliability are critical.

With the expansion of its power protection portfolio Infineon supports the growing requirements for power path protection solutions for current and future high-power AI server ecosystems ranging from 48 V to +/-400 V and 800 V. 

AVIVA Links entered into a definitive agreement to get acquired by NXP Semiconductors, demonstrating the industry’s support for the Automotive SerDes Alliance Motion Link open standards.

CoreWeave, Inc. announced an expanded agreement with OpenAI to power the training of its most advanced next-generation models, reinforcing its position as the essential cloud platform for the most demanding AI workloads.

TDK Corporation has jointly developed a prototype of a reservoir AI chip using an analog electronic circuit that mimics the cerebellum with Hokkaido University.

Alpha Networks Inc. announced the launch of its newly developed 1.6T liquid-cooled switch equipped with the Broadcom Tomahawk 6 chip to deliver up to 102.4 Tbps of switching capacity. It is optimized for AI data centers, cloud applications, and next-generation networks with high energy efficiency and advanced cooling.

Molex has released the results of a survey exploring top trends, technology innovations, and evolving career skills impacting design engineers at aerospace and defense companies. 

Infineon´s CoolGaN transistors enable reliable, high-performance solutions and help UMEC develop safer and energy-efficient technology to address modern power system challenges. 

Continuously improving efficiency, power density, and signal integrity of power conversion from the grid to the core is therefore critical to advancing computing performance while reducing total cost of ownership. To address this need, Infineon is launching the OptiMOS™ TDM22545T dual-phase power module, the industry's first TLVR module specifically designed for high-performance AI data centers.