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YINCAE announced the launch of its next-generation liquid metal thermal interface material (TIM), engineered with enhanced viscosity properties to deliver exceptional performance, processability, and long-term reliability.
Samtec offers development and evaluation kits to ensure and validate that its interconnect products meet customers’ performance requirements. This includes military/aerospace applications and using COTS and open standards products.
The new range of X1/Y2 safety-certified multilayer ceramic capacitors offers more options for electrical engineers designing high-power, compact power electronics.
Teradyne, Inc. announces the launch of the Magnum 7H, a next-generation memory tester designed to meet the rigorous demands of testing high bandwidth memory devices, integrated with GPUs and accelerators in high-performance, generative AI servers.
Indium Corporation announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
Anritsu announces that it has helped AMD accelerate the testing of electrical compliance for the PCI Express specification for pre-production AMD EPYC CPUs.
Ericsson and AT&T reveal that, for the first time, a third-party RAN automation application, an rApp, has successfully performed optimization activity on a Communication Service Provider’s live production network.
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