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Flex Power Modules and Bear VAI Technology are coming together to offer and support the Flex Power Modules range of DC/DC conversion products in the Midwest U.S.
The increasing demand for data processing is the primary driving force behind the growth in four key application areas. However, each application has specific requirements that necessitate different advanced semiconductor packaging technologies.
EDI CON China 2024 returns to Beijing and the Chinese National Convention Center April 9-10 with an industry exhibition as well as a technical conference.
Next-generation SiC diodes combine high surge current robustness with low forward voltage drop, capacitive charge, and reverse leakage current to increase efficiency and reliability in switching power designs.
A team from University College London, led by Dr. Amin Amiri, is studying the PDCs and developing a radar-based early warning system with a very high level of sensitivity, with a a PCIe digitizer card by Spectrum Instrumentation at its core.
To meet the latest design and application needs, Infineon Technologies AG introduces the next generation of the EiceDRIVER product family of dual-channel galvanically isolated gate driver ICs.
To provide BEV and HEV designers with a faster, more reliable high-voltage circuit protection solution, Microchip Technology has announced the E-Fuse Demonstrator Board, enabled by SiC technology, available in six variants.
By augmenting its cascode offering with seven new e-mode devices, Nexperia now provides designers with the optimum choice of GaN FETs from a single supplier alongside its substantial portfolio of silicon-based power electronics components.
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