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Rohde & Schwarz will be an exhibitor in person this year at DesignCon 2021 with its extensive product and solutions portfolio. As this year’s highlight, a live demonstration of the R&S RTO6 oscilloscope will be presented.

Carlisle Interconnect Technologies announced that it will be exhibiting products in the upcoming DesignCon 2021 Expo August 16-18, 2021 in San Jose, California, including Right-Angle CoreHC^TM cable assemblies and Solderless/Field-Replaceable Precision RF connectors.

Anritsu Company will host a series of Anritsu Test Talks on Wednesday, August 18 during DesignCon, the premier high-speed communications and system design conference.

At DesignCon 2021, Keysight's technical experts will highlight high-speed digital designs across all product development stages which enables customers to anticipate test challenges and optimize performance, as well as accelerate time-to-market of high-speed computing interfaces, data center connections and consumer electronics.  

Mini-Circuits will sponsor EDI CON Online 2021's 5G, Wi-Fi and IoT track, which comprises a full day of programming on Wednesday, August 4, focused on market drivers and technical considerations in these rapidly evolving application areas.

Infineon Technologies introduced the industry’s first high-voltage microcontroller (MCU) with USB Power Delivery (USB PD) 3.1 support. The EZ-PD™ PMG1 (Power Delivery Microcontroller Gen1) is Infineon’s first generation of USB PD MCUs targeting any embedded system that provides or consumes power with high-voltage up to 28 V (140 W).

FTDI Chip has announced a development solution. This hardware is based on its FT4233HP multi-channel interface ICs.

Mercury Systems Inc., announced the SCFE6931 processing module, the first in the industry to incorporate integrated artificial intelligence (AI) processing functionality.

VadaTech announces the VT971. The VT971 is a rugged conduction cooled unit which follows VITA 47 for environmental up to CC4/C3/V3/OS2. The unit accepts 32 high-speed SERDES to the Xilinx XCVU13P FPGA, which is supported by two 64-bit wide banks for DDR4 memory for the total of 16GB of memory.

Laird R&F Products now offers a series of thermal products that help aerospace and defense design engineers tackle rising heat loads in advanced electronics.