Industry News

Industry News Thumb

Rogers Corporation to Show Latest High Speed Laminates

Next Generation Thin Materials for Millimeter Wave Multi-Layer Designs at DesignCon 2019

Rogers Corporation will return to DesignCon in Santa Clara, CA (at booth #421) and show the XtremeSpeed™ RO1200Ô laminates and RO4000® products used in multi-layer structures which include a family of thin laminates, bonding materials, and sheeted copper foil options.


Read More
Ironwood

Lever Actuated Spring Pin Socket for BGA320

Ironwood Electronics recently introduced a BGA socket addressing high performance requirements for micro controller unit - CBT-BGA-6084. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. This socket can be used for hand test and temperature cycling as well as debugging application in development and device characterization. 


Read More
Industry News Thumb

Simberian to demonstrate Simbeor THz software with new features at DesignCon 2019

Simberian Inc. will participate in the DesignCon 2019 conference and exhibition, January 29th – 31st at the Santa Clara Convention Center. Simberian will be presenting Simbeor THz electromagnetic signal integrity software updated with distributed computing on Linux platform, Simbeor SDK module with API for design automation in C/C++ and Matlab, and with completely automated post-layout de-compositional electromagnetic analysis.


Read More
Industry News Thumb

ANSYS and Helic Sign Acquisition Agreement

Acquisition will complement ANSYS’ portfolio to enable next-generation products in 5G and artificial intelligence

ANSYS announced today that it has entered into a definitive agreement to acquire Helic, the industry-leading provider of electromagnetic crosstalk solutions for systems on chips (SoCs). By combining the Helix products with its own flagship electromagnetic and semiconductor solvers, ANSYS aims to provide a comprehensive solution for on-chip, 3D integrated circuit and chip-package-system electromagnetics and noise analysis. 


Read More
EDI CON CHINA PREVIEW

EDI CON China 2019 Preview

EDI CON China 2019 announces a preview of the technical conference and opening of registration for this year’s conference and exhibition. The event returns to Beijing and the Chinese National Convention Center (CNCC) April 1-3.


Read More