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In a significant development for the world of AME, J.A.M.E.S announces a strategic partnership with APES. This collaboration is set to drive innovation, amplify brand awareness, and foster groundbreaking advancements in the field of 3D Printed Electronics.

The new TESD devices’ unique design features proprietary bidirectional clamping cells for ESD protection up to ±30kV in an ultra-small DFN0603 package.

SCHURTER introduces its new FMAB NEO High-Performance single-phase block filter, designed to meet the demands of increasing electromagnetic interference generated in modern-day electronic applications.

The R&S MXO 5 is the company’s first eight-channel oscilloscope. It expands upon the industry-firsts pioneered by the R&S MXO 4 and will empower engineers to tackle even more demanding design challenges.

Spirent Communications has announced a collaboration with Cadence Design Systems, Inc. to deliver a joint networking system-on-chip verification solution that bridges the gap between pre-silicon and post-silicon verification.  

The global automotive SoC market is on the brink of reaching a substantial valuation, projected to reach US$18,141.9 million by 2023, according insights are based on a report by Future Market Insights. 

At this year’s Brooklyn 6G Summit, visitors can experience the first demonstration of how a neural receiver paired with a learned custom modulation performs in a 5G NR UL MIMO scenario, from Rohde & Schwarz and NVIDIA.

Würth Elektronik presents new additions to the WE-AGDT series, with interwinding capacitance lower than 1 picofarad, more topologies and higher output voltage options.

A new option from Spectrum Instrumentation offers a user-friendly way to create multi-channel data acquisition systems with ultrafast sampling speeds up to 10 GS/s. 

Nordson ELECTRONICS SOLUTIONS will showcase exciting, new products for conformal coating, precision fluid dispensing, and selective soldering at Productronica in Munich, Germany, November 14-17, 2023.