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The new KGP Series commercial-grade stacked MLCCs are engineered to optimize the performance of high-frequency applications in the industrial, alternative energy, and downhole oil and gas industries and support the miniaturization and sustainability megatrends.

In the report “Thermal Management For Data Centers 2026-2036: Technologies, Markets, and Opportunities”, IDTechEx further details the technical and commercial barriers to both single- and two-phase immersion cooling, as well as a comprehensive roadmap and timeline for upcoming cooling technologies based on extensive primary and secondary research.

Infineon supports the 800 VDC power architecture announced by NVIDIA at Computex 2025 for AI infrastructure. A shift to a centralized 800 VDC architecture allows for reduced power losses, higher efficiency and reliability. However, the new architecture requires new power conversion solutions and safety mechanisms to prevent potential hazards and costly server downtimes.

Preliminary findings from Dell'Oro Group's recently updated "Private Wireless" report suggest that the positive momentum driving the roughly 40% increase in 2024 extended into 1H25, with worldwide private wireless RAN revenues accelerating rapidly in the first half.

YINCAE is proud to announce the release of UF 66L, a next-generation OCU engineered for silicon photonics, optoelectronic packaging, image sensors, AR/VR modules, and advanced flip-chip assemblies where optical clarity, thermal endurance, and reliability are critical.

With the expansion of its power protection portfolio Infineon supports the growing requirements for power path protection solutions for current and future high-power AI server ecosystems ranging from 48 V to +/-400 V and 800 V. 

AVIVA Links entered into a definitive agreement to get acquired by NXP Semiconductors, demonstrating the industry’s support for the Automotive SerDes Alliance Motion Link open standards.

CoreWeave, Inc. announced an expanded agreement with OpenAI to power the training of its most advanced next-generation models, reinforcing its position as the essential cloud platform for the most demanding AI workloads.

TDK Corporation has jointly developed a prototype of a reservoir AI chip using an analog electronic circuit that mimics the cerebellum with Hokkaido University.

Alpha Networks Inc. announced the launch of its newly developed 1.6T liquid-cooled switch equipped with the Broadcom Tomahawk 6 chip to deliver up to 102.4 Tbps of switching capacity. It is optimized for AI data centers, cloud applications, and next-generation networks with high energy efficiency and advanced cooling.