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Rohde & Schwarz has opened a new larger office in Osaki, Japan, with increased capabilities, to deliver an innovation advantage for the Japanese automotive community.
Siemens and NVIDIA to build AI-accelerated portfolio including AI-native electronic design, AI native simulation as well as AI driven adaptive manufacturing and supply chain.
As the world’s first open and vendor-independent FPGA module standard, oHFM brings the proven success of COM principles to the FPGA ecosystem, offering a new level of flexibility for developers and silicon partners alike.
Successful validation of a 0.5-megawatt system for the U.S. Navy’s 10 MW Advanced Circuit Breaker Development Program demonstrates Menlo Micro’s scalable power-switching platform addressing aerospace & defense, data center, and industrial markets.
At the event, YINCAE will highlight TM 150LM liquid metal thermal interface material in combination with LA 150 rubber sealant, a material system designed to deliver low thermal impedance while significantly reducing mechanical stress on chips.
The Rubin platform harnesses extreme codesign across hardware and software to deliver up to 10x reduction in inference token cost and 4x reduction in number of GPUs to train MoE models, compared with the NVIDIA Blackwell platform.
Researchers from the University of Glasgow’s James Watt School of Engineering have developed a new method of interfacial imprinting ultra-thin nanowires onto bendable, transparent polymeric substrates.
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