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TDK Corporation has expanded its PLEC69B series of thin-film inductors, used for separating the data signal from the power in optical transceivers in AI data centers.
Infineon Technologies AG is expanding its CoolSiC™ MOSFETs 650 V G2 portfolio with new 75 mΩ variants to meet the demand for more compact and powerful systems.
According to a recently published report from Dell’Oro Group, preliminary findings reveal that RAN market conditions continued to stabilize in the quarter.
Yole Group announces the release of the "Automotive Semiconductor Trends 2025" report, offering unmatched insights into the competitive dynamics of the fastest-growing segment of the semiconductor industry.
The optical transport equipment market grew 14% year-over-year in 2Q 2025. This high growth rate was primarily attributed to the rising demand for disaggregated WDM and data center interconnect.
The Printed Circuit Engineering Association has announced that FPGA Horizons will colocate its technical conference and exhibition with PCB East 2026 at the DCU Center in Worcester, Mass., next spring.
IDTechEx’s report, “AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts” reveals current and emerging AI chips in the market, and their implications on the broader AI market.
Pickering Interfaces announced a new family of high-voltage programmable resistor modules in a compact single-slot PXI and PXIe form factor, model 40-230 (PXI) and 42-230 (PXIe), providing a simple solution for applications requiring voltage handling up to 1.2 kV.
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