Power Integrity

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Infineon Technologies AG is expanding its CoolSiC™ MOSFETs 650 V G2 portfolio with new 75 mΩ variants to meet the demand for more compact and powerful systems.

AI data centers are power hungry, pushing power density to new highs while requiring long-term reliability. The increasing power density, particularly at the board and rack levels, creates challenges for stability and the unpredictable high-current surges resulting from these many-core applications.  These difficulties are driving a significant amount of new development in capacitors while also inspiring the repurposing of older technologies. Sandler examines the opportunities and challenges presented by evolving demands in the power integrity sector. 

This paper, previously presented at DesignCon 2025, introduces a comprehensive framework for achieving 12.8 Gbps HBM3/4-to-SoC integration using innovative interposer technologies. This summary covers the key methodologies, findings, and implications of the study, focusing on practical solutions to SI-PI challenges in HBM interfaces.

The new devices deliver optimized thermal performance, system efficiency, and power density. They were specifically designed for demanding industrial applications that require high performance and reliability.

This article presents a simple yet effective method to roll your own TDR using any square wave source, any scope, and an affordable power splitter. This low-cost approach offers a practical and accessible solution for characterizing transmission lines in educational or resource-constrained lab environments. 

Yole Group publishes its Power Electronics for Data Centers 2025 report, revealing how power availability, AI servers, and WBG technologies are reshaping data center architecture.

The rapid advancement of electrification has revolutionized the energy and mobility sectors and provides decisive impulses for industry and society. Power electronics is the indispensable driver of this transformation. With the acquisition of ZES ZIMMER, Rohde & Schwarz complements its broad T&M portfolio.

Yole Group unveils 2024 power electronics companies’ rankings and market outlook amid overcapacity, price tension, and new global dynamics.

High-density power modules and 48 V power delivery network enable midrange vehicles to adopt luxury feature.

Infineon collaborates with NVIDIA for industry-first 800 V power delivery architecture for AI data centers.