Power Integrity

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This article describes the use of Cadence’s Sigrity signal and power integrity solution ML optimization algorithm to quickly and efficiently converge on the best set of parameters in a set of IBIS-AMI models. The application of Sigrity was investigated for refining IBIS- AMI parameters to find the optimal set of values to maximize a specific metric.

Infineon has announced that CoolSiC™ MOSFETs have been adopted in the new bZ4X model from Toyota, the world's largest automaker.

Vishay Intertechnology, Inc. has introduced five new 1200 V MOSFET power modules designed to increase power efficiency for medium to high frequency applications in automotive, energy, industrial, and telecom systems.

Würth Elektronik now also offers its WE-LT conductive textile gaskets in a halogen-free version.

The power SiC device market is forecast to approach $10 billion by 2030.

Spacechips has introduced its AI1 transponder, a small on-board processor card containing an adaptive compute acceleration platform AI accelerator.

Breakthrough Bypass Dual Duty-Cycle architecture minimizes voltage droop and accelerates AI workloads, setting a new industry benchmark.

The three variable step-down MicroModules for input voltages from 2.5 V to 5.5 V and adjustable output voltages from 0.6 V to 4 V are available in pin-compatible 1 A, 2 A, and 3 A versions. The modules achieve a peak efficiency of up to 96%. With their low quiescent current of 4 µA, they are also suitable for battery-powered applications.

As Ray Kurzweil’s predictions edge closer to reality, AI continues to transform engineering, education, and daily life. Follow along as Signal Integrity Journal Technical Editor Eric Bogatin examines the risks and rewards of technological evolution while reflecting on the role of humans in an AI-driven future.

The IPOSIM from Infineon Technologies AG is widely used to calculate losses and thermal behavior of power modules, discrete devices, and disc devices. The platform now integrates a SPICE-based model generation tool that incorporates external circuitry and gate driver selection into system-level simulations.