Power Integrity

PAM2 vs. PAM4 Signaling: Simply Explained

Mon, 18 May 2026 00:00:00 -0400

When Frequency Shapes Time: How S-Parameter Properties Shape Simulated TDR Behavior

Thu, 14 May 2026 00:00:00 -0400

Machine Learning Models for SI/PI Analysis with Meshed Planes

Wed, 13 May 2026 00:00:00 -0400

Infineon’s new XHP™ 2 CoolSiC™ High-Power Modules Boost Efficiency and Power Density in High-Voltage Energy Systems

Mon, 11 May 2026 00:00:00 -0400

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its XHP™ 2 power module portfolio with new variants incorporating CoolSiC™ MOSFETs 2300 V, designed for high-voltage power systems.

Evolution of the PDN Design Process: Explaining the Second Paradigm Shift

Mon, 11 May 2026 00:00:00 -0400

SIJ Publishes April 2026 Issue

Sat, 09 May 2026 00:00:59 -0400

Signal Integrity Journal, covering signal integrity, power integrity and EMC/EMI, has published its April 2026 issue. Don't miss out on the latest. Download now!

Stop Breaking the Loop: Modern Closed-Loop Stability in ADS

Mon, 27 Apr 2026 00:00:00 -0400

Ultra-Low Insertion Inductance, Ultra-High-Bandwidth Resistors

Tue, 21 Apr 2026 00:00:00 -0400

By treating the resistor as an electromagnetic structure rather than a lumped element, and by managing coupling, shielding, thermal paths, and compensation as part of a unified design, it becomes possible to achieve ultra‑low insertion inductance and gigahertz‑class measurement bandwidth in a device small enough for production use. The result is a measurement element that enhances system performance rather than limiting it. As power systems continue to push toward higher speed, higher density, and higher reliability, the current‑sense resistor must evolve accordingly. In this article, Steve Sandler outlines a path to that evolution.

Why Power Architectures Constrain New Space AI Missions

Mon, 20 Apr 2026 00:00:00 -0400

Rohde & Schwarz to Host Power Electronics Online Conference “From Design to Validation” in May

Sun, 19 Apr 2026 00:00:27 -0400

Rohde & Schwarz will host the Power Electronics Online Conference “From Design to Validation” on May 5 and 6, 2026.

Sensitivity of PCIe Connector Return Loss to Mating Interface and PCB Footprint Impedance Variations

Thu, 16 Apr 2026 00:00:47 -0400

OneWeb Satellite’s 50V/10 Half-Bridge Driver Development

Thu, 19 Mar 2026 00:00:00 -0400

By leveraging radiation-hardened GaN HEMTs and a compact, high-efficiency design, EPC Space not only met the stringent demands of size, weight, reliability, and performance, but exceeded them, delivering modules that have proven their worth in the harsh environment of space. Read on to learn more about how this success underscores the potential of GaN-based solutions to drive the next generation of satellite systems, paving the way for more affordable, sustainable, and resilient space exploration.

Mitigating Ground Loop Errors in High-Current PDN Measurements: Validating Measurement Accuracy Across Oscilloscope Platforms

Mon, 16 Mar 2026 01:00:00 -0400

As currents increase and voltage rails shrink, managing fluctuations becomes a critical challenge. While probe noise is a major factor, the common-mode noise induced by the ground loop between the high-current DUT and the oscilloscope is often the more dominant disruptor in high-current AI environments. This experiment proves that simply switching oscilloscope vendors will not solve the problem. Read on to learn why the solution lies in the probing chain.

Micross Introduces H+ Screened DC-DC Converters for LEO Constellations and New Space Missions

Wed, 04 Mar 2026 11:12:38 -0500

This series provides a cost-effective, radiation-tolerant power conversion solution for low-earth-orbit satellite constellations, new space missions, launch vehicles, and other space-based systems.

Richardson RFPD Introduces Wolfspeed Gen 4 MOSFETs Delivering Next Generation Efficiency and Real World Performance

Thu, 26 Feb 2026 11:46:04 -0500

Richardson RFPD, Inc. announced the expanded availability of Wolfspeed’s Gen 4 SiC MOSFET platform, engineered to deliver efficiency, simplified switching behavior, and long‑term reliability for today’s most demanding high‑power applications.

Infineon Advances GaN Ease-of-Use with Integrated Half-Bridge Solutions Launching CoolGaN™ Drive HB 600 V G5

Thu, 26 Feb 2026 11:08:07 -0500

Infineon Technologies AG expands its CoolGaN™ portfolio with the CoolGaN Drive HB 600 V G5 product family.

Optimization of IBIS-AMI Model Parameters with Machine Learning Algorithms

Wed, 18 Feb 2026 00:00:00 -0500

This article describes the use of Cadence’s Sigritysignal and power integrity solution ML optimization algorithm to quickly and efficiently converge on the best set of parameters in a set of IBIS-AMI models. The application of Sigrity was investigated for refining IBIS- AMI parameters to find the optimal set of values to maximize a specific metric.

Infineon's Silicon Carbide Power Semiconductors Selected for TOYOTA's New “bZ4X”

Mon, 09 Feb 2026 08:26:14 -0500

Infineon has announced that CoolSiC™ MOSFETs have been adopted in the new bZ4X model from Toyota, the world's largest automaker.

Vishay Intertechnology 1200 V SiC MOSFET Power Modules in Industry-Standard SOT-227 Package Increase Power Efficiency

Wed, 28 Jan 2026 13:16:48 -0500

Vishay Intertechnology, Inc. has introduced five new 1200 V MOSFET power modules designed to increase power efficiency for medium to high frequency applications in automotive, energy, industrial, and telecom systems.

Würth Elektronik Offers Halogen-Free Conductive Textile Gaskets

Wed, 28 Jan 2026 08:01:11 -0500

Würth Elektronik now also offers its WE-LT conductive textile gaskets in a halogen-free version.

Power SiC Faces Overcapacity Downturn While China Accelerates Domestic Equipment Ambitions

Thu, 18 Dec 2025 09:45:03 -0500

The power SiC device market is forecast to approach $10 billion by 2030.

Spacechips Drives Imaginative New AI-Enabled Satellite Applications

Sun, 07 Dec 2025 00:00:13 -0500

Spacechips has introduced its AI1 transponder, a small on-board processor card containing an adaptive compute acceleration platform AI accelerator.

Endura Technologies’ Power Solution Unlocks Peak Performance and Throughput Gains for AI Systems

Sun, 09 Nov 2025 00:00:09 -0500

Breakthrough Bypass Dual Duty-Cycle architecture minimizes voltage droop and accelerates AI workloads, setting a new industry benchmark.

Würth Elektronik Expands its MagI³C-VDMM MicroModule Series

Wed, 05 Nov 2025 08:34:44 -0500

The three variable step-down MicroModules for input voltages from 2.5 V to 5.5 V and adjustable output voltages from 0.6 V to 4 V are available in pin-compatible 1 A, 2 A, and 3 A versions. The modules achieve a peak efficiency of up to 96%. With their low quiescent current of 4 µA, they are also suitable for battery-powered applications.

The Impact of AI at the Singularity

Sun, 02 Nov 2025 23:00:00 -0500

As Ray Kurzweil’s predictions edge closer to reality, AI continues to transform engineering, education, and daily life. Follow along as Signal Integrity Journal Technical Editor Eric Bogatin examines the risks and rewards of technological evolution while reflecting on the role of humans in an AI-driven future.

Infineon Adds SPICE-Based Model Generation to IPOSIM Platform for More Accurate System-Level Simulation

Mon, 27 Oct 2025 08:51:00 -0400

The IPOSIM from Infineon Technologies AG is widely used to calculate losses and thermal behavior of power modules, discrete devices, and disc devices. The platform now integrates a SPICE-based model generation tool that incorporates external circuitry and gate driver selection into system-level simulations.

From Chargers to Data Centers: Power GaN Market Set for Rapid Sixfold Expansion by 2030

Fri, 24 Oct 2025 08:33:46 -0400

Power GaN 2025, powered by Yole Group, provides a detailed look at the market growth, technology trends, and strategic shifts shaping the gallium nitride power device industry.

Infineon Launches Industry’s First Radiation Hardened Buck Controller with Integrated Gate Drive

Tue, 21 Oct 2025 00:00:24 -0400

Designed for point of load power rails in commercial space systems and other extreme environments, the new device is particularly well-suited for distributed satellite power systems and digital processing payloads, including FPGA and ASIC systems.

CoolSiC™ MOSFETs 1400 V G2 in TO-247PLUS-4 Reflow Package Enhance Power Density in High-Power Applications

Fri, 17 Oct 2025 10:44:31 -0400

Infineon has launched the CoolSiC™ MOSFETs 1400 V G2 in the TO-247PLUS-4 Reflow package. The devices support higher DC-link voltages and enable improved thermal performance, reduced system size and enhanced reliability.

Infineon Advances Gallium Nitride Innovation in Automotive with First 100 V Automotive-Qualified Transistors

Wed, 15 Oct 2025 09:26:15 -0400

Infineon is further advancing on its path to become a leading GaN powerhouse and bolstering its position as the world’s leader in automotive semiconductors by introducing its first GaN transistor family qualified to the AEC standard for automotive applications.