Sponsored by: EDI CON CHINA

Design Rule Checks for High-Speed PCB Design

By Patrick Carrier

Coping with SI (signal integrity) and EMI (electromagnetic interference) issues is a daily challenge for PCB design engineers. This article By Patrick Carrier discusses some of the common SI and EMI issues that can be found using DRCs.

PASSIVE PLUS, INC. CUSTOM ASSEMBLIES OFFERING

Passive Plus, Inc. (PPI) offers Custom Capacitor Assemblies for high power requirements. Typical assemblies are configured in series and/or parallel combinations, producing higher voltage/current handling capabilities, extended capacitance range and tighter tolerances.

AXIe Consortium and Multiple Companies Announce Optical Communication Standard for Instrumentation Systems

The AXIe Consortium announced a new specification, Optical Data Interface, suitable for high-speed instrumentation systems addressing challenging applications in 5G communications, mil/aero, and advanced communication research.
 

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Verifying power integrity for DDR memories
 

By Rohde & Schwarz

EDI CON USA Keynote Talks - Bet Your Job, 5G in 5 Years and T&M Value

The EDI CON USA 2017 keynote speakers addressed the latest engineering trends and challenges in our industry from “in the trenches” stories of design challenges, successes and failures from “Bet Your Job” to “5G in 5 Years” look into the future to a behind the scenes look at T&M.

A Vehicle For Insitu Glass Fabric Characterization – Technical Session from EDI CON
 

A PCB-based glass fabric characterization vehicle is presented that yields statistically worst-case glass skew for single-ended transmission lines. It also demonstrates the behavior of best/worst case differential trace pitch design.

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