Samtec, Inc. will be demonstrating next-generation, high-performance optical and copper interconnect solutions in South Hall booth #1101 at the upcoming OFC exhibition (March 17-19 at Los Angeles Convention Center, Los Angeles, Calif.)

Samtec high-speed interconnects are well suited for use in high-performance designs such as AI/high-performance computing, medical, test & measurement, and FPGA applications. This year at OFC, Samtec will showcase demonstrations that incorporate leading-edge Si-Fly® HD CPX Co-Packaged Systems and Si-Fly HD backplane for optical and copper applications up to 448 Gbps, including silicon and optical engines from multiple partners; FireBlade™ OCP OAI EXP Module; Halo™ next-gen optical system and FireFly™ mid-board optical transceivers; and the Bulls Eye® BE130 high-performance test system for 448 Gbps.

Related Resources

Samtec Releases Line of DC to 90 GHz Connectors with Alignment Features
Solder Chemistry to Feature Solder Paste at SMTConnect
Langer EMV-Technik To Show HR-E 40-1 Near-Field Probe And PA 2522 Preamplifier At DesignCon

OIF Interoperability Demo

On the exhibit floor at OFC 2026, OIF’s interoperability showcase (booth #2017) serves as a vendor proving ground, translating implementation agreements (IAs) into working, repeatable interoperability so operators can reduce integration risk, maintain sourcing flexibility and move from innovation to deployment with greater confidence. This year’s demonstrations will feature collaboration in four critical technology areas: 400ZR, 800ZR, Multi-Span Coherent Optics, Multi-Core Fiber (MCF) and IP/Optical Controllers; Common Electrical I/O (CEI) CEI-448G and CEI-224G; Co-Packaging; Common Management Interface Specification (CMIS) and Energy Efficient Interfaces (EEI).

Samtec’s products will be included in the CEI interoperability as well as the EEI and Co-Packaging demonstrations. As part of the OIF Interoperability Demo, Samtec’s Bulls Eye ISI Evaluation Board offers numerous variable length signal paths with known loss profiles beyond 130 GHz. When combined with Bulls Eye High-Performance Test System, the combined solution offers an easy-to-use test platform for easy validation and verification of high-speed SerDes and evaluating and demonstrating 224 Gbps PAM4 and 448 Gbps signal performance.

Si-Fly HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solution in today's market. Electrically pluggable CPC and CPO (known as CPX) are achievable on a 95 mm x 95 mm or smaller substrate using Samtec's SFCM connector. The SFCM mounts directly to the package substrate and is pluggable with Samtec's SFCC cable assembly or an optical cable assembly of your choosing. 224/448 Gbps prototypes are demonstrated within the CEI and EEI demonstrations.