Items Tagged with 'interconnect'

Samtec, Inc. will be demonstrating next-generation, high-performance optical and copper interconnect solutions in South Hall booth #1101 at the upcoming OFC exhibition

Keysight has introduced 3D Interconnect Designer, a new addition to its EDA portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications.

While the lossless characteristics of superconducting interconnect can trigger visions of tremendous bandwidths over infinite physical distances, superconductors have unique properties that can appreciably affect signal integrity in unexpected ways. This article introduces kinetic inductance from the eyes of signal integrity with the aim of preparing engineers to analyze superconducting links.

Point2 Technology’s e-Tube offers a compelling alternative to copper cables and optics. It extends copper’s reliability and economics to support terabit-scale data rates in a lightweight, power-efficient, and highly manufacturable form to address short reach, AI cluster scale-up in data centers. With roadmap scalability to multi-terabit and compatibility with standard cable form factors, e-Tube redefines the compute fabric for next-generation AI clusters.

Revision to PCIe 6.4 and PCIe 7.0 specifications provide the industry’s first standard-based PCIe optical solution targeting AI, cloud, and data center applications.

According to a recently published report from Dell’Oro Group, the optical transport equipment market grew 1 percent year-over-year in 1Q 2025. However, due to the strong demand for data center interconnect, the optical equipment market in the North American region experienced a 24 percent year-over-year growth.

Yuriy Shlepnev of Simberian outlines the fundamental elements of DEA, examines the conditions for its accuracy, and highlights its growing importance in the future of interconnect design.

Crosstalk problems here to stay as long as interconnects are designed as the open waveguiding systems. Thus, understanding and proper quantification of the crosstalk and mitigation of the consequences are important. This article outlines multiple possible ways to quantify the crosstalk: coupling coefficients, frequency domain metrics, time-domain analysis of crosstalk, and a modern statistical approach. 

Interconnect pioneers use premier electronics industry event to showcase wider digital cable solution capabilities.

Sivers Semiconductors AB is in advanced discussions with its strategic customer, Ayar Labs, to partner on the next phase of engagement focused on manufacturing at scale to support deployment of Ayar labs in-package optical interconnect solutions.