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Ultra-low-impedance power distribution network (PDN) structures are difficult to correlate because the impedance of the device under test (DUT) can be comparable to artifacts introduced by probe coupling, probe landing, reference-plane placement, and electromagnetic solver configuration settings. This article shows some possible full-wave 3D simulation workflows for the IEEE TC-EDMS Benchmark Problem V, a four-via test case on 1 mm pitch in which the vias are shorted together on the L2 plane.
Samtec, Inc., the service leader in the connector industry, will be demonstrating next-generation, high performance optical and copper interconnect solutions in booth #2004 at the upcoming ECOC exhibition.
Samtec, Inc., the service leader in the connector industry, announces full production quantity availability of its new 1.85 mm 30-degree angled launch board connector (185-AL Series).
Samtec, Inc., the service leader in the connector industry, announces the release of the ARJ6 cable-to-cable, high-density panel mount cable assembly. Supporting PCI® 6.0/CXL® 3.2 and 100 GbE in AI architectures and FPGA prototyping, the ARJ6 cable assembly is part of Samtec's popular AcceleRate® HP family with 112 Gbps PAM4 performance per channel.
Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new high-frequency, 50 Ohm impedance, SMA edge-mount board connector delivering repeatable, reliable performance through 26.5 GHz.
Samtec, Inc announced production quantity availability of single-ended and mixed single-ended / differential pair signaling options using AcceleRate® Slim Cable Assemblies.
Samtec, Inc. will be demonstrating next-generation, high-performance optical and copper interconnect solutions in South Hall booth #1101 at the upcoming OFC exhibition
