DesignCon, the premier high-speed communications and system design conference, returns to its home at the Santa Clara Convention Center in Santa Clara, Calif., with technical paper sessions, tutorials, industry panels, product demos, and exhibits, January 30 to February 1, 2024.
DesignCon’s conference program covers all aspects of electronic design, including signal and power integrity, high-speed link design, and machine learning.
DesignCon attendee interests continue to be strongest in optimizing high-speed link design, boasting the highest 2023 event attendance and also holding the highest number of paper submissions for 2024. The number of paper submissions for the upcoming conference is usually a good indicator of research activity and overall interest. For 2024, we have seen the next highest number of submissions for the core topics of modeling, analysis, and optimization of interconnects.
Following are some of the highest-rated sessions by DesignCon’s Technical Program Committee peer reviewers for the upcoming 2024 event:
“Considerations for Achieving 200 Gbps Signaling per Electrical Lane Over 1 Meter of Twinaxial Copper Cable” is a combined effort from Alphawave Semi, Amphenol, Cisco Systems, Keysight Technologies, MC Communications, PHY-SI, Rohde & Schwarz, and Samtec. This is expected to be important research for the continued evolution of IEEE 802.3 Ethernet specs.
“Design, Simulation & Validation Challenges of a Scalable 2000 Amp Core Power Rail” from Broadcom Semiconductors, Monolithic Power Systems, Keysight Technologies, PICOTEST, and Signal Edge Solutions should provide a good mix of design, simulation, and measurement validation. It will be particularly helpful that the authors plan to offer correlation to real hardware.
“224-Gbps MLSD Receiver Simulations & Correlations with OIF-CEI-224G/802.3dj COM Methodology” from Intel plans to provide both implementation of MLSD in the simulation flow and correlation with COM script. The session is expected to include a clear reason for using MSLD for receiver equalizer optimization for higher data rates and longer reach interconnects.
“Physics-Based Via to Stripline Model for Systematic Link Simulation on Multilayer Cavities Up to 100 GHz” is from the EMC Lab at Missouri University of Science and Technology. It’s beneficial to have a physics-based analytical formula to calculate the impedance of via-trace transition rather than getting results from full wave simulation. If the paper’s claims come through, this could be a great contribution to the industry.
“A Novel PCB Footprint for Double-Sides Stacked Optical Module Application” comes from Cisco. Footprints have a huge impact on performance, and very often they are dictated by mechanical restrictions. Optimizing footprints isn’t done properly by many companies, so this information could have a beneficial impact on the DesignCon community.
“Automotive High-Speed Serial: How the Harsh Environment Challenges Established Technology & Test Methods” from Valens Semiconductor and BitifEye Digital Test Solutions aims to address design, diagnostic, and compliance testing methodologies required to ensure durable, error-free automotive communication links composed of interoperable components through the vehicle lifespan. Discussion of the requirements of the current HSS automotive standards will be included.
“Panel – Test on Wheels: T&M for Automotive Standards” will bring attendees up-to-date on how the automotive industry is solving the signal integrity challenges of this uniquely noisy, hot/cold, wet/icy/smoky, and violent environment. Now in its third year, the panel will include engineers from BMW, Keysight, and other leaders.
Attendee Pass Information
In total, DesignCon 2024 is offering more than 120 educational sessions. Conference passholders will continue to have access to the 14 tracks of education, with more than 85 sessions curated by our 97-person Technical Program Committee. Additionally, DesignCon has expanded its Drive World conference from eight sessions to 20+ sessions, focused on engineering in the autonomous and electric vehicle industries. Supporting DesignCon’s Drive World education will be a dedicated Advanced Automotive section of the expo floor, hosting suppliers with a specific focus on automotive and energy storage design.
Additionally, all attendees have access to daily keynotes, panels, Chiphead Theater presentations, exhibitor-led education, the Engineer of the Year and Best Paper Awards presentations, and the DesignCon expo floor.
Among 150+ exhibitors, DesignCon’s expo floor will present some of the industry’s most influential companies, including host sponsor Amphenol, Cadence, Keysight, Molex, Mouser, Samtec, TE Connectivity, and more. Experts from these companies will be on-site to answer design questions, provide advice on engineering, and present educational demonstrations on the latest in high-speed design tools, technologies, and developments.
New in 2024, DesignCon launches its 40 Under 40 program, celebrating 40 up-and-coming engineers. These engineers will be recognized ahead of and at the event as rising stars, and will receive access to all DesignCon education in Santa Clara, in addition to the expo floor offering an exclusive breakfast with industry leading expert engineers and mentors.
DesignCon’s 2024 exhibition is open Wednesday and Thursday, January 31 and February 1, and the conference is presented Tuesday, Wednesday, and Thursday, January 30-Februaury 1. Registration is open now. More information on the full event is available on DesignCon.com.