Items Tagged with 'design'

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PC Board Design for Low EMI in IoT Products

Most of today’s digital-based products create a large amount of on-board RF harmonic “noise” (EMI). While this digital switching won’t usually bother the digital circuitry itself, that same harmonic energy from digital clocks, high-speed data buses, and especially on-board DC-DC switch-mode power supplies can easily create harmonic interference well into the 600 to 850 MHz cellular phone bands and even as high as 1575 MHz GPS/GNSS bands, causing receiver “desense” (reduced receiver sensitivity).


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The Truth About High-Speed Connector Design

It’s Not as Simple as Just Putting Metal and Plastic Together

In the high-speed connector design arena, there are two opposing ideas. For some people, if you simply put pieces of plastic and metal together, eventually you have a signal transmission. This process is very simple. On the other end of the spectrum, there is the idea that a solid connector design requires a deep understanding of electromagnetic theory, a wisdom only sorcerers and wizards possess.


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Making a Steamy, Hairy Golf Ball

My friend Steve Sandler pointed out a major hurdle we face in power distribution design: power engineers (who design power converters) and power integrity engineers (who design system bypassing-decoupling networks) use different vocabulary, techniques, and requirements. To understand a little better how we got here, I want to start with a prediction I heard sometime in the early 90s at one of the conference keynote speeches: “In 10 to 20 years, computers will look like hairy steamy golf balls.” 


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EDI CON China 2018 Announces Winners In Innovation Awards

Winners announced in test & measurement, software/EDA, semiconductors, components, and materials.

Last night, at EDI CON China 2018, the conference and exhibition that brings together engineers working on high-frequency analog and high-speed digital designs, the winners were announced in the EDI CON Innovation Awards. This award program honors products that have had the greatest impact on the industry this year, providing the tools necessary to bring on the next generation of electronic design innovations.


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Zuken Announces XJTAG DFT Assistant for CR-8000 PCB Design Suite

Zuken® and XJTAG®, a leader in boundary scan and design for test technology, have entered into a partnership to enhance Zuken’s CR-8000 with a design for test (DFT) capability that will improve test coverage during schematic entry. The capability is based on XJTAG’s DFT Assistant, and will be available later this year as a free plugin for Zuken’s CR-8000 Design Gateway users.


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Polar Launches Online Base Material Libraries for Speedstack PCB Layer Stackup Design System

Polar Instruments - a specialist provider of tools for PCB design, fabrication and test - has launched new online base material libraries for Speedstack, the industry’s favorite PCB layer stackup design system. In addition, Polar is encouraging other base material suppliers to provide updated data to make this the most comprehensive updated material library resource for PCB specifiers.


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Microsemi and Analog Devices Collaborate on Scalable SiC MOSFET Driver Solutions

Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and Analog Devices, Inc., the leading global high-performance analog technology company, announced a scalable Silicon Carbide (SiC) driver reference design solution based on a range of Microsemi SiC MOSFET products and Analog Device's ADuM4135 5KV isolated gate driver. The dual SiC MOSFET driver reference design provides user-friendly design guides enabling faster time to market for customers using Microsemi SiC MOSFETs and supports the transition to Microsemi's next generation SiC MOSFETs.


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