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There seems to be more standards every day, and some have rumored that there is a movement to merge or consolidate some existing standards. We will examine some of the standards and how they came to be. For starters, we will limit ourselves to three main types of standards in the industry: on-board or internal, input/output (I/O), and networking. I/O and networking are similar, but networking standards typically apply to longer distance links than I/O standards.
Recently, Signal Integrity Journal caught up with Todd Cutler, Keysight’s VP and General Manager for Design & Test Software about product development, innovation, and the latest developments in SI/PI design. Read on to learn more.
Microwave Vision Group (MVG) has announced the integration of Radiated Spurious Emissions (RSE) and passive antenna measurement capabilities into its popular, compact and highly accurate lab-based test system, MiniLAB.
Nano Dimension Ltd., announced that it has developed 3D printed capacitors with the Company’s DragonFly additive manufacturing system. These capacitors are embedded in the body of the additively manufactured printed circuit boards (PCBs), saving space and eliminating the need for assembly.
Processing components such as FPGAs, MCUs and CPUs have specific power supply requirements. Their multiple supplies need to power-up and power-down in a specified time sequence in order to avoid damage. The supply voltage tolerances are tight and require a carefully designed power supply. Download the app note to learn more.
Didn't get a chance to attend EDI CON Online? Catch all Signal Integrity, Power Integrity and EMC/EMI related technical sessions, workshops, and the keynote on demand at your leisure. Content is available for free, to attendees live and on-demand.
Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience. Browse webinars here.
