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April 9, 2019

Sponsored by: Signal Integrity Journal



Better, Faster, More Confident 25+ Gbps Via Design: Applying Decomposition and Image Impedance

By Ben Toby and Dr. Karl Joseph Bois

This method enables designers to create 25+ GT/s vias quickly, deliberately, and with much less uncertainty than the traditional technique. Read on to find out more.

News Feature1

MathWorks Announces Release 2019a of MATLAB and Simulink

MathWorks introduced the Release 2019a of MATLAB and Simulink. The release contains new products and important enhancements for artificial intelligence (AI), signal processing, and static analysis, along with new capabilities and bug fixes across all product families.

News Feature2

A*STAR and Soitec Launch Joint Program to Develop a New Layer Transfer Process for Advanced Packaging

Agency for Science, Technology and Research's (A*STAR) Institute of Microelectronics (IME) and Soitec (Euronext Paris), announce the launch of a joint program to develop and integrate a new layer transfer process within advanced wafer level multi-chip packaging techniques.


Rohde & Schwarz


EMI Debugging on Board Level

Sponsored By Rohde & Schwarz
EMI radiation and crosstalk caused by poor shielding can lead to signal quality and performance degradation in electronic RF devices. To minimize the overall EMI of electronic devices, local radiation sources on the integrated boards and modules must be well known. Download the app note to discover more.

EDI CON China 2019

EDI CON China Announces Innovation Award Winners

By Janine Love
On April 2, EDI CON China 2019 announced the winners and presented the trophies to company representatives in its second annual EDI CON CHINA Product Innovation Awards. The ceremony was presided over by Winson Xing, Editor Microwave Journal China, and Carl Sheffres, Publisher of Microwave Journal & Exhibition Manager.


Upcoming Webinar

Rohde & Schwarz

Understanding SNDR and All that Goes Into It

In this seminar, we’ll use the Signal to noise and dispersion ratio measurement as a lab to understand not only SNDR, but the important quantities that go into it and many other measurements: pulse response and how it relates to features of interconnects like transfer functions and impulse response as well as ISI (inter-symbol interference); waveform fitting, fit deviations, and signal distortion; and measurement of the steady state voltage and pulse peak. In the process, we’ll see exactly how SNDR compares electrical signal strength to the combination of random noise and harmonic distortion.


Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience.
Browse webinars here.


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