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April 30, 2019

Sponsored by: Rohde & Schwarz

Rohde & Schwarz


Seven Habits of Successful 2-Layer Board Designers

By Eric Bogatin

If performance matters, if the interconnects are not transparent, or if you want to develop good habits, you will want to incorporate these seven habits in your next two layer board design.


News Feature1

PCIM Europe 2019: Rohde & Schwarz Presents T&M Solutions for Power Electronics

Rohde & Schwarz will present its family of oscilloscopes and power supplies for power electronics applications at PCIM Europe International Exhibition and Conference from May 7 to 9, 2019, in Nuremberg. Learn more.

News Feature2

Keysight Technologies Announces New Time Domain and Real Time Scan Capabilities in EMI Receiver Solution

Keysight Technologies, Inc. announced the addition of Time Domain Scan (TDS) and Real Time Scan (RTS) capabilities to the Keysight N9048B PXE Electromagnetic Interference (EMI) receiver and enables real time measurements and diagnostics for faster electromagnetic compliance (EMC) certification.




New 112G Submersible Optical Transceiver

Sponsored By Samtec Inc.
One technology holding back the adoption of liquid cooling has been the lack of optical transceivers which perform reliably while submersed. This live demonstration shows an immersion cooling system with a new Samtec submersible optical transceiver running at 112 Gbps. Watch the video to discover more.

EDI CON Online

EDI CON Online Will Reach Global Audience

The Electronic Design Innovation Conference and Exhibition (EDI CON) announced that this year, in conjunction with Microwave Journal (MWJ) and Signal Integrity Journal (SIJ), it will host an online, interactive event for high frequency and high speed design engineers on September 10-12, 2019. The interactive technical sessions will occur at no cost to attendees, and sponsors will have the opportunity to present workshops and keynote sessions as part of the daily schedule.


Webinar available on-demand

Microwave Journal Webcast: Comparing RF Technologies for Next-Generation 5G and Optical Communications Systems

The increasing frequencies and data rates required for next-generation communications hardware, whether 5G wireless or 400-800 Gbps optical, are driving more demanding performance from the circuits and components that make up these systems. Technology options and trade-offs must be carefully evaluated to develop the highly optimized chips needed to keep pace with the performance, features and function these systems must deliver. This webinar will review available silicon and gallium arsenide process technology options and identify advantages, disadvantages and design considerations for RF semiconductor solutions in these advanced communications systems. Register today.


Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience.
Browse webinars here.

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