We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Cookie Policy.
Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its new high-frequency, 50 Ohm impedance, SMA edge-mount board connector delivering repeatable, reliable performance through 26.5 GHz.
Samtec, Inc announced production quantity availability of single-ended and mixed single-ended / differential pair signaling options using AcceleRate® Slim Cable Assemblies.
Samtec, Inc. will be demonstrating next-generation, high-performance optical and copper interconnect solutions in South Hall booth #1101 at the upcoming OFC exhibition
Samtec interconnects selected to improve signal integrity and reduce SWaP of evolving VITA standards requiring miniaturization and functionality advancements.
This article details the electromagnetic simulation of low frequencies in Ansys Electronics Desktop, focusing specifically on arbitrary length transmission lines and cables with uniform cross sections. It presents two-dimensional, quasi-static field and circuit solvers as an alternative simulation method, covering the simulation workflow while highlighting the differences and benefits of using this method as opposed to using predominant full-wave field solvers.
Samtec announces that it will showcase high-performance interconnect solutions and enabling technologies that support data rates up to 448 Gbps and signals up to 130 GHz in booth #939 at DesignCon 2026.
Samtec, Inc. has implemented a variety of strategic options to help minimize tariff exposure while maintaining competitive pricing and the industry’s best lead times for its customers.
This article discusses electrical and thermal co-simulation of multi-pin interconnects. Using Ansys Q3D and Icepak (2025R1), it highlights key practices such as parametrization, matrix reduction, and mesh settings to ensure accurate and efficient results with complex geometries.
