Items Tagged with 'transmission'

Semiconductor signal conditioning and signal recovery innovations have extended data rates by managing allowable signal-to-noise ratio (SNR) at progressively higher Nyquist frequencies. We have experienced how each successive signaling technology increases the electro-mechanical design resolution needed to address the channel physics while respecting the SNR of the chips. These movements throughout the years have provided a baseline of traditional design goals that lead us to better understand today’s 224 Gbps-PAM4 physical layer requirements.

SIJ editorial advisory board member Yuriy Shlepnev offers a comparison of three ways to visualize the same s-parameter data, identifying how to get the most information from a plot.

When starting a new project, board designers are often overwhelmed when trying to choose appropriate diff pair geometry, board material, and stackup to meet high-speed serial link loss budgets. Part of the printed circuit board (PCB) interconnect challenge is modeling transmission lines accurately. 

Rosenberger has introduced the High-Speed FAKRA-Mini HFM® connector series. This new generation of automotive coaxial connectors for frequency applications up to 15 GHz is a modular system enabling fast transmission of high data rates up to 20 Gbps.