Eric Bogatin, Signal Integrity Journal Technical Editor
Eric Bogatin, Signal Integrity Journal Technical Editor RSS FeedRSS

Eric Bogatin_new headshot_100

Eric Bogatin is Technical Editor at Signal Integrity Journal and the Dean of the Teledyne LeCroy Signal Integrity Academy. Additionally, he is an Adjunct Professor at the University of Colorado - Boulder in the ECEE Dept. Eric improves the signal to noise ratio by sorting through all of the information available and finding the best quality content to publish on signalintegrityjournal.com.

Making Lemonade with the 10x Scope Probe

“There are two kinds of engineer, those who are building antennas on purpose and those who are not doing it on purpose.” Every oscilloscope ships with at least two 10x probes. They are ubiquitous in every lab. But they have a significant problem above 10 MHz, unless care is taken. In some cases, we can turn this problem into a feature.


Read More

Nuggets from New Orleans

One reason I enjoy attending a conference is the opportunity to browse presentations I would not ordinarily see. I always pick up something new and useful. Here are some from my recent visit to the IEEE EMC Symposium.


Read More

Young Professionals Placed in Jeopardy at 2019 EMC Symposium

On the first day of the 2019 IEEE EMC Symposium, Louann Mlekodaj, Eriko Yamato, Patrick DeRoy and other members of the EMC YP committee organized a Jeopardy game for the Young Professionals Group. As fitting the format of the Jeopardy show at an EMC event, answer categories covered, of course, EMC, SI and PI topics. Read on to test yourself!


Read More

Just how good are VNA Measurements?

Just because someone has a VNA capable of 60 GHz bandwidth doesn’t mean it will always give the same results. It is not the instrument, but the measurement procedure that seems to influence the quality of the measurements the most.  Read on for information on a recent study from Jason Ellison, Heidi Barnes, and Jose Moreira  as well as 7 tips for improving your measurements.


Read More

The Future of Power Integrity

Get six experts in a room together and you are likely to hear seven different opinions. Not so at the Future of Power Integrity Panel Discussion at DesignCon 2019.  The consensus of this panel of experts is that the future of power integrity will include single processor chips drawing as much as 1000 A and more. Read on for the details of this discussion!


Read More