- "A Guide for Single-Ended to Mixed-Mode S-parameter Conversions" by Bert Simonovich
- "The Myth of Three Capacitor Values" by Eric Bogatin, Larry Smith, and Steve Sandler
- "From Smooth to Imperfect Vias: The Rough Truth Impacting Simulation Model Accuracy" by Bert Simonovich
- "Innovative Layout Optimization Methodology and Via Routing Pattern to Enable UCIe-36 Gbps in Organic Interposer" by Ilamparidhi I., Suriya Prakash T., and Yadavalli Jagadeeswari, Alphawave Semi
- "Analysis of Skew" by Gustavo Blando and Prashant Pappu, Amazon Web Services
- "Futuring Interconnect Infrastructure for AI: RF Transmission over Plastic Cable Surpasses Copper and Optics at Terabit Scale" by David Kuo, Point2 Technology
- "Intra-Pair Skew: Wave Propagation in Screened Single Pair" by Boris Dardel, Fabrice Pfefferli, Laurent van Rysselberghe, Wolfgang Klein, Denis Milz, and Vincent Arbet-Engles, AESA
- "Feedforward Equalizer Location Study for High-Speed Serial Systems" by Kevin Zheng, Boris Murmann, Hongtao Zhang, and Geoff Zhang
- "Ethernet Connectors and Routing Above Ground Planes" by Zachariah Peterson
- "Innovative Interposer Solutions for HBM3/4: A Path to 12.8 Gbps" by Ilamparidhi I., Suriya Prakash T., Gangaraju M., Yadavalli Jagadeeswari, and Diksha Acharya, Alphawave Semi
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