Pat Hindle, SIJ Contributing Editor
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Pat Hindle

Pat Hindle is responsible for editorial content, article review and special industry reporting for Signal Integrity Journal and Microwave Journal magazines plus their web sites. He also leads social media and special digital projects. Prior to joining the Journals, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT's Space Nanostructures Laboratory. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.

Test System Addresses Demands of 56/112G PAM4 Using Upcoming IEEE P370 Standard

eSilicon was in the Samtec booth at DesignCon 2019 presenting their collaboration with Wild River Technology to develop an advanced test system that addresses the difficult signal integrity demands of 56/112G PAM4 operation. The test system design utilizes the upcoming IEEE P370 standard in association with compliance metrics 802.3bs, OIF CEI – 56G PAM4, and COBO to validate the required performance.


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Measurement Instruments for the Many

Rohde & Schwarz has always been known for high end, very accurate instruments in the high frequency but did you know that R&S has a portfolio of value class instruments with more than 100 products and 300 accessories? From their recent release, here is a summary of the new value instrument additions they highlighted.


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Book Review - A Practical Guide to EMC Engineering

Levent Sevgi, who has worked with electromagnetics for almost three decades, wrote this book to address the breadth of EMC engineering topics that are not covered by more specialized texts: market control, accreditation, calibration, EMC testing and measurement and mitigation.


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Engineer What’s Next – NIWeek 2017

This is the first year that NIWeek has taken place in late May instead of its normal early August time slot and switches permanently to this part of the calendar. NIWeek 2017 kicked off with new CEO Alex Davern paying tribute to Dr. T with a standing ovation from the audience. Read this summary of what happened at NIWeek 2017.


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Compatibility in the Capital - IEEE EMC 2016

EMC 2016 featured Dr. Robert Scully, NASA Johnson Space Lab, kicking off the plenary session with his light hearted talk, “EMC in 2016 and Beyond: What Is It and Why Do We Care?”. As the IEEE EMC is an international organization, they periodically hold EMC outside of the US so traveled to Ottawa, Canada this year. 


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FCC Chairman Lays Out Innovation Based 5G Plan

Recommends Spectrum Allocation through mmWave Bands

FCC Chairman Tom Wheeler laid out his proposal for 5G spectrum allocation that he hopes will be approved by Congress on July 14. It is a comprehensive plan to designate spectrum in the low frequency bands, develop more mid-band frequencies in the crowed areas currently used and a gives specific focus to high frequency bands in the mmWave range. He stated that we will be the first in the world to approve these types of measures if Congress gives their approval next month. 


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Meeting Chiphead

DesignCon 2016 Summary

It was fun meeting Chiphead for the first time at DesignCon 2016. The event covers areas such as PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more. The test/measurement, software and connector companies dominate the exhibition. As the speed of digital electronics has increased, the techniques and methods for digital and RF/microwave design have converged so it was interesting to see the similarities between the two worlds.


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